Experimental study of thermomigration in lead-free nanoelectronics solder joints

Mohd F. Abdulhamid; Cemal Basaran; Douglas C. Hopkins

doi:10.1115/IMECE2006-13119

Experimental study of thermomigration in lead-free nanoelectronics solder joints

Mohd F. Abdulhamid
, Cemal Basaran
, Douglas C. Hopkins

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu₆Sn₅ IMC. Small voids can be seen within the Cu₆Sn₅ IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

Original language	English
Title of host publication	Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging
Publisher	American Society of Mechanical Engineers (ASME)
ISBN (Print)	0791837904, 9780791837900
DOIs	https://doi.org/10.1115/IMECE2006-13119
State	Published - 2006
Event	2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Chicago, IL, United States Duration: Nov 5 2006 → Nov 10 2006

Publication series

Name	American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP
ISSN (Print)	1071-6947

Conference

Conference	2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006
Country/Territory	United States
City	Chicago, IL
Period	11/5/06 → 11/10/06

Access to Document

10.1115/IMECE2006-13119

Cite this

Abdulhamid, M. F., Basaran, C., & Hopkins, D. C. (2006). Experimental study of thermomigration in lead-free nanoelectronics solder joints. In Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2006-13119

Abdulhamid, Mohd F. ; Basaran, Cemal ; Hopkins, Douglas C. / Experimental study of thermomigration in lead-free nanoelectronics solder joints. Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME), 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP).

@inproceedings{d7451077d46f4f40bb6536367f2b56fe,

title = "Experimental study of thermomigration in lead-free nanoelectronics solder joints",

abstract = "The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.",

author = "Abdulhamid, \{Mohd F.\} and Cemal Basaran and Hopkins, \{Douglas C.\}",

year = "2006",

doi = "10.1115/IMECE2006-13119",

language = "English",

isbn = "0791837904",

series = "American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP",

publisher = "American Society of Mechanical Engineers (ASME)",

booktitle = "Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging",

address = "United States",

note = "2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 ; Conference date: 05-11-2006 Through 10-11-2006",

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Abdulhamid, MF, Basaran, C & Hopkins, DC 2006, Experimental study of thermomigration in lead-free nanoelectronics solder joints. in Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP, American Society of Mechanical Engineers (ASME), 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006, Chicago, IL, United States, 11/5/06. https://doi.org/10.1115/IMECE2006-13119

Experimental study of thermomigration in lead-free nanoelectronics solder joints. / Abdulhamid, Mohd F.; Basaran, Cemal; Hopkins, Douglas C.
Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME), 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Experimental study of thermomigration in lead-free nanoelectronics solder joints

AU - Abdulhamid, Mohd F.

AU - Basaran, Cemal

AU - Hopkins, Douglas C.

PY - 2006

Y1 - 2006

N2 - The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

AB - The study of thermomigration on Sn-Ag-Cu solder sphere subjected to a high thermal gradient of 1100°C/cm is presented. After 286 hours, the hot end showed a thin and flat intermetallic compound (IMC) while the cold side showed a scallop-like Cu6Sn5 IMC. Small voids can be seen within the Cu6Sn5 IMC after 712 hours on the cold side, while the IMC on the opposite side showed no observable changes.

UR - https://www.scopus.com/pages/publications/85196520724

U2 - 10.1115/IMECE2006-13119

DO - 10.1115/IMECE2006-13119

M3 - Conference contribution

AN - SCOPUS:85196520724

SN - 0791837904

SN - 9780791837900

T3 - American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP

BT - Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging

PB - American Society of Mechanical Engineers (ASME)

T2 - 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006

Y2 - 5 November 2006 through 10 November 2006

ER -

Abdulhamid MF, Basaran C, Hopkins DC. Experimental study of thermomigration in lead-free nanoelectronics solder joints. In Proceedings of 2006 ASME International Mechanical Engineering Congress and Exposition, IMECE2006 - Electronic and Photonics Packaging. American Society of Mechanical Engineers (ASME). 2006. (American Society of Mechanical Engineers, Electronic and Photonic Packaging, EPP). doi: 10.1115/IMECE2006-13119

Experimental study of thermomigration in lead-free nanoelectronics solder joints

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