Erratum: Electromigration analysis of solder joints under ac load: A mean time to failure model (Journal of Applied Physics (2012) 111 (063703))

Wei Yao; Cemal Basaran

doi:10.1063/1.4718914

Erratum: Electromigration analysis of solder joints under ac load: A mean time to failure model (Journal of Applied Physics (2012) 111 (063703))

Wei Yao
, Cemal Basaran

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Contribution to journal › Comment/debate

1 Scopus citations

Original language	English
Article number	099906
Journal	Journal of Applied Physics
Volume	111
Issue number	9
DOIs	https://doi.org/10.1063/1.4718914
State	Published - May 1 2012

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Erratum: Electromigration analysis of solder joints under ac load: A mean time to failure model (Journal of Applied Physics (2012) 111 (063703))

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