Epoxy-based carbon films with high electrical conductivity attached to an alumina substrate

Yasuhiro Yamada; D. D.L. Chung

doi:10.1016/j.carbon.2008.07.001

Epoxy-based carbon films with high electrical conductivity attached to an alumina substrate

Yasuhiro Yamada
, D. D.L. Chung

Department of Mechanical and Aerospace Engineering

SUNY Buffalo

Research output: Contribution to journal › Letter › peer-review

11 Scopus citations

Abstract

Carbon-based films (0.8-13 μm thick) with good bonding to the substrate and high processability were produced at 650 °C on an alumina substrate, using SU 2.5 bisphenol-A type novolac epoxy (plus triethyleneteramine curing agent) as the carbon precursor. This precursor gave crack-free and scratch resistant carbon films. Interconnected filamentary nickel nanoparticles were more effective for conductivity enhancement than silver nanoparticles or multiwalled carbon nanotubes at 5 vol.% or below, in spite of the high conductivity of silver and the high aspect ratio of nanotubes. The carbon film with 2.5 vol.% nickel showed resistivity 6 × 10^-3 Ω cm.

Original language	English
Pages (from-to)	1798-1801
Number of pages	4
Journal	Carbon
Volume	46
Issue number	13
DOIs	https://doi.org/10.1016/j.carbon.2008.07.001
State	Published - Nov 2008

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title = "Epoxy-based carbon films with high electrical conductivity attached to an alumina substrate",

abstract = "Carbon-based films (0.8-13 μm thick) with good bonding to the substrate and high processability were produced at 650 °C on an alumina substrate, using SU 2.5 bisphenol-A type novolac epoxy (plus triethyleneteramine curing agent) as the carbon precursor. This precursor gave crack-free and scratch resistant carbon films. Interconnected filamentary nickel nanoparticles were more effective for conductivity enhancement than silver nanoparticles or multiwalled carbon nanotubes at 5 vol.\% or below, in spite of the high conductivity of silver and the high aspect ratio of nanotubes. The carbon film with 2.5 vol.\% nickel showed resistivity 6 × 10-3 Ω cm.",

author = "Yasuhiro Yamada and Chung, \{D. D.L.\}",

year = "2008",

month = nov,

doi = "10.1016/j.carbon.2008.07.001",

language = "English",

volume = "46",

pages = "1798--1801",

journal = "Carbon",

issn = "0008-6223",

publisher = "Elsevier Ltd",

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T1 - Epoxy-based carbon films with high electrical conductivity attached to an alumina substrate

AU - Yamada, Yasuhiro

AU - Chung, D. D.L.

PY - 2008/11

Y1 - 2008/11

N2 - Carbon-based films (0.8-13 μm thick) with good bonding to the substrate and high processability were produced at 650 °C on an alumina substrate, using SU 2.5 bisphenol-A type novolac epoxy (plus triethyleneteramine curing agent) as the carbon precursor. This precursor gave crack-free and scratch resistant carbon films. Interconnected filamentary nickel nanoparticles were more effective for conductivity enhancement than silver nanoparticles or multiwalled carbon nanotubes at 5 vol.% or below, in spite of the high conductivity of silver and the high aspect ratio of nanotubes. The carbon film with 2.5 vol.% nickel showed resistivity 6 × 10-3 Ω cm.

AB - Carbon-based films (0.8-13 μm thick) with good bonding to the substrate and high processability were produced at 650 °C on an alumina substrate, using SU 2.5 bisphenol-A type novolac epoxy (plus triethyleneteramine curing agent) as the carbon precursor. This precursor gave crack-free and scratch resistant carbon films. Interconnected filamentary nickel nanoparticles were more effective for conductivity enhancement than silver nanoparticles or multiwalled carbon nanotubes at 5 vol.% or below, in spite of the high conductivity of silver and the high aspect ratio of nanotubes. The carbon film with 2.5 vol.% nickel showed resistivity 6 × 10-3 Ω cm.

UR - https://www.scopus.com/pages/publications/52949132233

U2 - 10.1016/j.carbon.2008.07.001

DO - 10.1016/j.carbon.2008.07.001

M3 - Letter

AN - SCOPUS:52949132233

SN - 0008-6223

VL - 46

SP - 1798

EP - 1801

JO - Carbon

JF - Carbon

IS - 13

ER -

Epoxy-based carbon films with high electrical conductivity attached to an alumina substrate

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