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Enhancement Mode In0.53Ga0.47As MOSFET with self-aligned epitaxial Source/Drain regrowth

  • Uttam Singisetti
  • , Mark A. Wistey
  • , Gregory J. Burek
  • , Ashish K. Baraskar
  • , Joël Cagnon
  • , Brian Thibeault
  • , Arthur C. Gossard
  • , Susanne Stemmer
  • , Mark J.W. Rodwell
  • , Eunji Kim
  • , Byungha Shin
  • , Paul C. McIntyre
  • , Yong Ju Lee
  • University of California at Santa Barbara
  • Stanford University
  • Intel

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

9 Scopus citations

Abstract

A scalable, self-aligned In0.53Ga0.47As MOSFET process was developed and enhancement mode device operation was demonstrated. The 0.7 μm Lg device shows a maximum drive current of 0.14 mA/μm at Vgs=4.0V and Vds=2.5 V. The devices have almost an order of magnitude larger drive current than our previously reported MOSFETs. The channel layer was 5 nm thick InGaAs with InAlAs bottom barrier for vertical confinement. 4.7 nm of Al2O3 (∼ 2 nm EOT) dielectric was deposited in an atomic layer deposition tool. After gate formation, self-aligned source/drain regions were defined by migration enhanced epitaxial (MEE) regrowth, and self-aligned in-situ Mo source/drain contacts were formed.

Original languageEnglish
Title of host publicationIEEE International Conference on Indium Phosphide and Related Materials, IPRM 2009
Pages120-123
Number of pages4
DOIs
StatePublished - 2009
EventIEEE International Conference on Indium Phosphide and Related Materials, IPRM 2009 - Newport Beach, CA, United States
Duration: May 10 2009May 14 2009

Publication series

NameConference Proceedings - International Conference on Indium Phosphide and Related Materials
ISSN (Print)1092-8669

Conference

ConferenceIEEE International Conference on Indium Phosphide and Related Materials, IPRM 2009
Country/TerritoryUnited States
CityNewport Beach, CA
Period05/10/0905/14/09

Keywords

  • III-V MOSFET
  • InGaAs MOSFET
  • MBE regrowth
  • MEE

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