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Engineering the future with ultrawide-bandgap semiconductors

  • Hong Kong University of Science and Technology
  • University of California at Santa Barbara
  • Leibniz-Institut im Forschungsverbund Berlin e.V.

Research output: Contribution to journalEditorial

Original languageEnglish
Article number050401
JournalAPL Materials
Volume14
Issue number5
DOIs
StatePublished - May 1 2026

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