Electromigration time to failure

Cemal Basaran; Shidong Li

Electromigration time to failure

Cemal Basaran
, Shidong Li

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Electromigration time to failure and electrical resistivity of 95.5%Sn-1.5%Ag-0.5%Cu-0.03W%Ni (SACN) microelectronics solder joints have been investigated experimentally. A Black's type electromigration time to failure equation is developed to describe the time to failure versus current density and temperature. It is observed that resistance of a solder joint is not just a function of the temperature but also a function of the current density. The activation energy over the range of 83°C∼174°C is measured to be 0.77±0.12eV, and the current density exponent is found to be (8.60±1.65). It is also shown that the most commonly used Black's electromigration time to failure equation cannot be used for solder joints.

Original language	English
Title of host publication	Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010
Pages	72-79
Number of pages	8
Edition	3 BOOK
State	Published - 2010
Event	Grand Challenges in Modeling and Simulation Symposium, GCMS 2010, Part of the 2010 Summer Simulation Multiconference, SummerSim 2010 - Ottawa, ON, Canada Duration: Jul 12 2010 → Jul 14 2010

Publication series

Name	Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010
Number	3 BOOK

Conference

Conference	Grand Challenges in Modeling and Simulation Symposium, GCMS 2010, Part of the 2010 Summer Simulation Multiconference, SummerSim 2010
Country/Territory	Canada
City	Ottawa, ON
Period	07/12/10 → 07/14/10

Keywords

Electromigration
Lead-free solder joints
Resistance evolution
Solder joint resistance
Temperature coefficient of resistance
Time to failure

Cite this

Basaran, C., & Li, S. (2010). Electromigration time to failure. In Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010 (3 BOOK ed., pp. 72-79). (Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010; No. 3 BOOK).

Basaran, Cemal ; Li, Shidong. / Electromigration time to failure. Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010. 3 BOOK. ed. 2010. pp. 72-79 (Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010; 3 BOOK).

@inproceedings{87e4a7403ee544e3b3906aeb20dc8c07,

title = "Electromigration time to failure",

abstract = "Electromigration time to failure and electrical resistivity of 95.5\%Sn-1.5\%Ag-0.5\%Cu-0.03W\%Ni (SACN) microelectronics solder joints have been investigated experimentally. A Black's type electromigration time to failure equation is developed to describe the time to failure versus current density and temperature. It is observed that resistance of a solder joint is not just a function of the temperature but also a function of the current density. The activation energy over the range of 83°C∼174°C is measured to be 0.77±0.12eV, and the current density exponent is found to be (8.60±1.65). It is also shown that the most commonly used Black's electromigration time to failure equation cannot be used for solder joints.",

keywords = "Electromigration, Lead-free solder joints, Resistance evolution, Solder joint resistance, Temperature coefficient of resistance, Time to failure",

author = "Cemal Basaran and Shidong Li",

year = "2010",

language = "English",

isbn = "9781617387043",

series = "Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010",

number = "3 BOOK",

pages = "72--79",

booktitle = "Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010",

edition = "3 BOOK",

note = "Grand Challenges in Modeling and Simulation Symposium, GCMS 2010, Part of the 2010 Summer Simulation Multiconference, SummerSim 2010 ; Conference date: 12-07-2010 Through 14-07-2010",

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Basaran, C & Li, S 2010, Electromigration time to failure. in Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010. 3 BOOK edn, Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010, no. 3 BOOK, pp. 72-79, Grand Challenges in Modeling and Simulation Symposium, GCMS 2010, Part of the 2010 Summer Simulation Multiconference, SummerSim 2010, Ottawa, ON, Canada, 07/12/10.

Electromigration time to failure. / Basaran, Cemal; Li, Shidong.
Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010. 3 BOOK. ed. 2010. p. 72-79 (Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010; No. 3 BOOK).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - Electromigration time to failure

AU - Basaran, Cemal

AU - Li, Shidong

PY - 2010

Y1 - 2010

N2 - Electromigration time to failure and electrical resistivity of 95.5%Sn-1.5%Ag-0.5%Cu-0.03W%Ni (SACN) microelectronics solder joints have been investigated experimentally. A Black's type electromigration time to failure equation is developed to describe the time to failure versus current density and temperature. It is observed that resistance of a solder joint is not just a function of the temperature but also a function of the current density. The activation energy over the range of 83°C∼174°C is measured to be 0.77±0.12eV, and the current density exponent is found to be (8.60±1.65). It is also shown that the most commonly used Black's electromigration time to failure equation cannot be used for solder joints.

AB - Electromigration time to failure and electrical resistivity of 95.5%Sn-1.5%Ag-0.5%Cu-0.03W%Ni (SACN) microelectronics solder joints have been investigated experimentally. A Black's type electromigration time to failure equation is developed to describe the time to failure versus current density and temperature. It is observed that resistance of a solder joint is not just a function of the temperature but also a function of the current density. The activation energy over the range of 83°C∼174°C is measured to be 0.77±0.12eV, and the current density exponent is found to be (8.60±1.65). It is also shown that the most commonly used Black's electromigration time to failure equation cannot be used for solder joints.

KW - Electromigration

KW - Lead-free solder joints

KW - Resistance evolution

KW - Solder joint resistance

KW - Temperature coefficient of resistance

KW - Time to failure

UR - https://www.scopus.com/pages/publications/84871399492

M3 - Conference contribution

AN - SCOPUS:84871399492

SN - 9781617387043

T3 - Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010

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BT - Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010

T2 - Grand Challenges in Modeling and Simulation Symposium, GCMS 2010, Part of the 2010 Summer Simulation Multiconference, SummerSim 2010

Y2 - 12 July 2010 through 14 July 2010

ER -

Basaran C, Li S. Electromigration time to failure. In Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010. 3 BOOK ed. 2010. p. 72-79. (Grand Challenges in Modeling and Simulation Symposium, GCMS 2010 - Proceedings of the 2010 Summer Simulation Multiconference, SummerSim 2010; 3 BOOK).

Electromigration time to failure

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