Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties

Minghui Lin; Cemal Basaran

doi:10.1016/j.commatsci.2004.10.007

Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties

Minghui Lin
, Cemal Basaran

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Contribution to journal › Article › peer-review

57 Scopus citations

Abstract

Electromigration is a major road block in the pursuit of further miniaturized electronics. In the next generation micro and sub micro electronics current density is expected to exceed 10⁷ A/cm ². In this paper an electromigration induced strain-current density model is proposed and implemented in finite element procedure for solution of boundary/initial value electromigration problems. Numerical simulations are compared with experimental data. Comparisons validate the model.

Original language	English
Pages (from-to)	82-98
Number of pages	17
Journal	Computational Materials Science
Volume	34
Issue number	1
DOIs	https://doi.org/10.1016/j.commatsci.2004.10.007
State	Published - Aug 2005

Keywords

Electromigration
Nanoelectronics packaging
Power electronics packaging
Solder joint
Thermomigration
Viscoplasticity

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10.1016/j.commatsci.2004.10.007

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title = "Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties",

abstract = "Electromigration is a major road block in the pursuit of further miniaturized electronics. In the next generation micro and sub micro electronics current density is expected to exceed 107 A/cm 2. In this paper an electromigration induced strain-current density model is proposed and implemented in finite element procedure for solution of boundary/initial value electromigration problems. Numerical simulations are compared with experimental data. Comparisons validate the model.",

keywords = "Electromigration, Nanoelectronics packaging, Power electronics packaging, Solder joint, Thermomigration, Viscoplasticity",

author = "Minghui Lin and Cemal Basaran",

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AU - Basaran, Cemal

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AB - Electromigration is a major road block in the pursuit of further miniaturized electronics. In the next generation micro and sub micro electronics current density is expected to exceed 107 A/cm 2. In this paper an electromigration induced strain-current density model is proposed and implemented in finite element procedure for solution of boundary/initial value electromigration problems. Numerical simulations are compared with experimental data. Comparisons validate the model.

KW - Electromigration

KW - Nanoelectronics packaging

KW - Power electronics packaging

KW - Solder joint

KW - Thermomigration

KW - Viscoplasticity

UR - https://www.scopus.com/pages/publications/17444404174

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DO - 10.1016/j.commatsci.2004.10.007

M3 - Article

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SP - 82

EP - 98

JO - Computational Materials Science

JF - Computational Materials Science

IS - 1

ER -

Electromigration induced stress analysis using fully coupled mechanical-diffusion equations with nonlinear material properties

Abstract

Keywords

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