Elastic modulus of Pb/Sn solder joints in microelectronics

Cemal Basaran; Jianbin Jiang

doi:10.1115/IMECE2002-39632

Elastic modulus of Pb/Sn solder joints in microelectronics

Cemal Basaran
, Jianbin Jiang

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

Young's modulus (E) values published in the literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.

Original language	English
Title of host publication	Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology
Publisher	American Society of Mechanical Engineers (ASME)
Pages	141-150
Number of pages	10
ISBN (Print)	0791836487, 9780791836484
DOIs	https://doi.org/10.1115/IMECE2002-39632
State	Published - 2002

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings

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10.1115/IMECE2002-39632

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Basaran, C., & Jiang, J. (2002). Elastic modulus of Pb/Sn solder joints in microelectronics. In Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology (pp. 141-150). (ASME International Mechanical Engineering Congress and Exposition, Proceedings). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE2002-39632

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abstract = "Young's modulus (E) values published in the literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.",

author = "Cemal Basaran and Jianbin Jiang",

year = "2002",

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language = "English",

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series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings",

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Elastic modulus of Pb/Sn solder joints in microelectronics. / Basaran, Cemal; Jiang, Jianbin.
Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. American Society of Mechanical Engineers (ASME), 2002. p. 141-150 (ASME International Mechanical Engineering Congress and Exposition, Proceedings).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Jiang, Jianbin

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N2 - Young's modulus (E) values published in the literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.

AB - Young's modulus (E) values published in the literature for the eutectic Pb37/Sn63 and near eutectic Pb40/Sn60 solder alloy vary significantly. One reason for this discrepancy is different testing methods for highly rate sensitive heterogeneous materials, like Pb/Sn alloys, yield different results. In this paper, we study different procedures used to obtain the elastic modulus; analytically, by single crystal elasticity and experimentally by ultrasonic testing and Nano indentation. We compare these procedures and propose a procedure for elastic modulus determination. The deformation kinetics of the Pb/Sn solder alloys is discussed at the grain size level.

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M3 - Conference contribution

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T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings

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BT - Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology

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ER -

Elastic modulus of Pb/Sn solder joints in microelectronics

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