Effects of thermodynamic loading

C. Basaran; Y. Zhao; A. Cartwright; T. Dishongh

Effects of thermodynamic loading

C. Basaran
, Y. Zhao
, A. Cartwright
, T. Dishongh

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Contribution to specialist publication › Article

Abstract

Concurrent thermal cycling and vibration tests were conducted to explore the cyclic behavior of solder joints and plasticity in vibration coupled with thermal cycling. Actual ball grid array (BGA) packages were used for testing. High sensitivity moire interferometry was used to capture the in-plane cyclic inelastic deformation field with submicron resolution.

Original language	English
Volume	9
No	9
Specialist publication	Advanced Packaging
State	Published - Oct 2000

Cite this

@misc{4df379ad03a946c68b9513b2f1697937,

title = "Effects of thermodynamic loading",

abstract = "Concurrent thermal cycling and vibration tests were conducted to explore the cyclic behavior of solder joints and plasticity in vibration coupled with thermal cycling. Actual ball grid array (BGA) packages were used for testing. High sensitivity moire interferometry was used to capture the in-plane cyclic inelastic deformation field with submicron resolution.",

author = "C. Basaran and Y. Zhao and A. Cartwright and T. Dishongh",

year = "2000",

month = oct,

language = "English",

volume = "9",

journal = "Advanced Packaging",

issn = "1065-0555",

publisher = "PennWell Corp.",

}

TY - GEN

T1 - Effects of thermodynamic loading

AU - Basaran, C.

AU - Zhao, Y.

AU - Cartwright, A.

AU - Dishongh, T.

PY - 2000/10

Y1 - 2000/10

N2 - Concurrent thermal cycling and vibration tests were conducted to explore the cyclic behavior of solder joints and plasticity in vibration coupled with thermal cycling. Actual ball grid array (BGA) packages were used for testing. High sensitivity moire interferometry was used to capture the in-plane cyclic inelastic deformation field with submicron resolution.

AB - Concurrent thermal cycling and vibration tests were conducted to explore the cyclic behavior of solder joints and plasticity in vibration coupled with thermal cycling. Actual ball grid array (BGA) packages were used for testing. High sensitivity moire interferometry was used to capture the in-plane cyclic inelastic deformation field with submicron resolution.

UR - https://www.scopus.com/pages/publications/0034290342

M3 - Article

AN - SCOPUS:0034290342

SN - 1065-0555

VL - 9

JO - Advanced Packaging

JF - Advanced Packaging

ER -

Effects of thermodynamic loading

Abstract

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