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Effect of thermal annealing on grain boundary chemistry of polycrystalline TlBa2Ca2Cu3Oy films

  • Z. L. Wang
  • , C. L. Briant
  • , J. DeLuca
  • , A. Goyal
  • , D. M. Kroeger
  • , J. A. Sutliff
  • , E. D. Specht
  • , J. E. Tkaczyk
  • Oak Ridge National Laboratory

Research output: Contribution to conference › Paper › peer-review

Abstract

The effect of thermal annealing on the boundary chemistry of Tl-1223 compounds (TlxBa2Ca2Cu3Oy) is studied. Results reveal that the enhancement of Jc in Tl-1223 films does not result from improvement of the properties of twist grain boundaries. The microstructure has been shown from X-ray diffraction and electron back-scattering diffraction studies to consist of colonies of grains with similar but not identical basal plane orientations, and it has been suggested that long-range conduction occurs through a percolative network of small-angle tilt boundaries at colony intersections.

Original languageEnglish
Pages968-969
Number of pages2
StatePublished - 1994
EventProceedings of the 52nd Annual Meeting of the Microscopy Society of America - New Orleans, LA, USA
Duration: Jul 31 1994 → Aug 5 1994

Conference

ConferenceProceedings of the 52nd Annual Meeting of the Microscopy Society of America
CityNew Orleans, LA, USA
Period07/31/94 → 08/5/94

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