Effect of stress on the electrical resistivity of solder

T. Kim; D. D.L. Chung

doi:10.1007/s11664-001-0126-8

Effect of stress on the electrical resistivity of solder

T. Kim
, D. D.L. Chung

Department of Mechanical and Aerospace Engineering

SUNY Buffalo

Research output: Contribution to journal › Article › peer-review

3 Scopus citations

Abstract

The electrical resistivity of tin-lead eutectic solder was found to increase upon tension. The effect was partially reversible. The fractional change in resistance per unit strain was 60. The irreversible part of the effect was due to plastic deformation.

Original language	English
Pages (from-to)	L29-L31
Journal	Journal of Electronic Materials
Volume	30
Issue number	10
DOIs	https://doi.org/10.1007/s11664-001-0126-8
State	Published - Oct 2001

Keywords

Electrical resistance
Electrical resistivity
Lead
Piezoresistivity
Solder
Stress
Tin

Access to Document

10.1007/s11664-001-0126-8

Cite this

@article{137aaf089bc246e2a863ebbde4a36bfc,

title = "Effect of stress on the electrical resistivity of solder",

abstract = "The electrical resistivity of tin-lead eutectic solder was found to increase upon tension. The effect was partially reversible. The fractional change in resistance per unit strain was 60. The irreversible part of the effect was due to plastic deformation.",

keywords = "Electrical resistance, Electrical resistivity, Lead, Piezoresistivity, Solder, Stress, Tin",

author = "T. Kim and Chung, \{D. D.L.\}",

year = "2001",

month = oct,

doi = "10.1007/s11664-001-0126-8",

language = "English",

volume = "30",

pages = "L29--L31",

journal = "Journal of Electronic Materials",

issn = "0361-5235",

publisher = "Springer New York",

number = "10",

}

TY - JOUR

T1 - Effect of stress on the electrical resistivity of solder

AU - Kim, T.

AU - Chung, D. D.L.

PY - 2001/10

Y1 - 2001/10

N2 - The electrical resistivity of tin-lead eutectic solder was found to increase upon tension. The effect was partially reversible. The fractional change in resistance per unit strain was 60. The irreversible part of the effect was due to plastic deformation.

AB - The electrical resistivity of tin-lead eutectic solder was found to increase upon tension. The effect was partially reversible. The fractional change in resistance per unit strain was 60. The irreversible part of the effect was due to plastic deformation.

KW - Electrical resistance

KW - Electrical resistivity

KW - Lead

KW - Piezoresistivity

KW - Solder

KW - Stress

KW - Tin

UR - https://www.scopus.com/pages/publications/0035484704

U2 - 10.1007/s11664-001-0126-8

DO - 10.1007/s11664-001-0126-8

M3 - Article

AN - SCOPUS:0035484704

SN - 0361-5235

VL - 30

SP - L29-L31

JO - Journal of Electronic Materials

JF - Journal of Electronic Materials

IS - 10

ER -

Effect of stress on the electrical resistivity of solder

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this