DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS

Nihat Okulan; Shekhar Bhansali; Arum Han; Saman Dharmatilleke; Jin Woo Choi; Manoj Patel; Kwang W. Oh; H. Thurman Henderson; Chong H. Ahn

doi:10.1115/IMECE1999-0277

DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS

Nihat Okulan
, Shekhar Bhansali
, Arum Han
, Saman Dharmatilleke
, Jin Woo Choi
, Manoj Patel
, Kwang W. Oh
, H. Thurman Henderson
, Chong H. Ahn

Department of Electrical Engineering

University of Cincinnati

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

3 Scopus citations

Abstract

This center is currently working on the development of a remotely accessible generic microfluidic system (“lab on a chip") for biological and biochemical analysis, based on electrochemical detection techniques. Modular microfluidic components, including micro reservoirs, microvalves, micropumps, filterless magnetic particle separators, biosensors and flowsensors, were fabricated and tested, and integrated on a system motherboard. Other air-to-liquid measurand concentrators and integrated sieve/filters are being explored in related efforts. The fabrication of these microfluidic components and the utilization of wax for low temperature assembly and even bonding is discussed.

Original language	English
Title of host publication	Micro-Electro-Mechanical Systems (MEMS)
Publisher	American Society of Mechanical Engineers (ASME)
Pages	259-264
Number of pages	6
ISBN (Electronic)	9780791816387
DOIs	https://doi.org/10.1115/IMECE1999-0277
State	Published - 1999
Event	ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999 - Nashville, United States Duration: Nov 14 1999 → Nov 19 1999

Publication series

Name	ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
Volume	1999-W

Conference

Conference	ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999
Country/Territory	United States
City	Nashville
Period	11/14/99 → 11/19/99

Access to Document

10.1115/IMECE1999-0277

Cite this

Okulan, N., Bhansali, S., Han, A., Dharmatilleke, S., Choi, J. W., Patel, M., Oh, K. W., Henderson, H. T., & Ahn, C. H. (1999). DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS. In Micro-Electro-Mechanical Systems (MEMS) (pp. 259-264). (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 1999-W). American Society of Mechanical Engineers (ASME). https://doi.org/10.1115/IMECE1999-0277

@inproceedings{a1043fcd02124fa89b4fae3caa028bd4,

title = "DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS",

abstract = "This center is currently working on the development of a remotely accessible generic microfluidic system (“lab on a chip{"}) for biological and biochemical analysis, based on electrochemical detection techniques. Modular microfluidic components, including micro reservoirs, microvalves, micropumps, filterless magnetic particle separators, biosensors and flowsensors, were fabricated and tested, and integrated on a system motherboard. Other air-to-liquid measurand concentrators and integrated sieve/filters are being explored in related efforts. The fabrication of these microfluidic components and the utilization of wax for low temperature assembly and even bonding is discussed.",

author = "Nihat Okulan and Shekhar Bhansali and Arum Han and Saman Dharmatilleke and Choi, \{Jin Woo\} and Manoj Patel and Oh, \{Kwang W.\} and Henderson, \{H. Thurman\} and Ahn, \{Chong H.\}",

note = "Publisher Copyright: {\textcopyright} 1999 American Society of Mechanical Engineers (ASME). All rights reserved.; ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999 ; Conference date: 14-11-1999 Through 19-11-1999",

year = "1999",

doi = "10.1115/IMECE1999-0277",

language = "English",

series = "ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)",

publisher = "American Society of Mechanical Engineers (ASME)",

pages = "259--264",

booktitle = "Micro-Electro-Mechanical Systems (MEMS)",

address = "United States",

}

Okulan, N, Bhansali, S, Han, A, Dharmatilleke, S, Choi, JW, Patel, M, Oh, KW, Henderson, HT & Ahn, CH 1999, DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS. in Micro-Electro-Mechanical Systems (MEMS). ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE), vol. 1999-W, American Society of Mechanical Engineers (ASME), pp. 259-264, ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999, Nashville, United States, 11/14/99. https://doi.org/10.1115/IMECE1999-0277

DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS. / Okulan, Nihat; Bhansali, Shekhar; Han, Arum et al.
Micro-Electro-Mechanical Systems (MEMS). American Society of Mechanical Engineers (ASME), 1999. p. 259-264 (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE); Vol. 1999-W).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS

AU - Okulan, Nihat

AU - Bhansali, Shekhar

AU - Han, Arum

AU - Dharmatilleke, Saman

AU - Choi, Jin Woo

AU - Patel, Manoj

AU - Oh, Kwang W.

AU - Henderson, H. Thurman

AU - Ahn, Chong H.

PY - 1999

Y1 - 1999

N2 - This center is currently working on the development of a remotely accessible generic microfluidic system (“lab on a chip") for biological and biochemical analysis, based on electrochemical detection techniques. Modular microfluidic components, including micro reservoirs, microvalves, micropumps, filterless magnetic particle separators, biosensors and flowsensors, were fabricated and tested, and integrated on a system motherboard. Other air-to-liquid measurand concentrators and integrated sieve/filters are being explored in related efforts. The fabrication of these microfluidic components and the utilization of wax for low temperature assembly and even bonding is discussed.

AB - This center is currently working on the development of a remotely accessible generic microfluidic system (“lab on a chip") for biological and biochemical analysis, based on electrochemical detection techniques. Modular microfluidic components, including micro reservoirs, microvalves, micropumps, filterless magnetic particle separators, biosensors and flowsensors, were fabricated and tested, and integrated on a system motherboard. Other air-to-liquid measurand concentrators and integrated sieve/filters are being explored in related efforts. The fabrication of these microfluidic components and the utilization of wax for low temperature assembly and even bonding is discussed.

UR - https://www.scopus.com/pages/publications/0038656997

U2 - 10.1115/IMECE1999-0277

DO - 10.1115/IMECE1999-0277

M3 - Conference contribution

AN - SCOPUS:0038656997

T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)

SP - 259

EP - 264

BT - Micro-Electro-Mechanical Systems (MEMS)

PB - American Society of Mechanical Engineers (ASME)

T2 - ASME 1999 International Mechanical Engineering Congress and Exposition, IMECE 1999

Y2 - 14 November 1999 through 19 November 1999

ER -

Okulan N, Bhansali S, Han A, Dharmatilleke S, Choi JW, Patel M et al. DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS. In Micro-Electro-Mechanical Systems (MEMS). American Society of Mechanical Engineers (ASME). 1999. p. 259-264. (ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)). doi: 10.1115/IMECE1999-0277

DEVELOPMENT OF PLANAR MICROFLUIDIC SYSTEMS USING CONVENTIONAL AND LOW TEMPERATURE ASSEMBLING SCHEMES FOR COMPONENTS

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