Abstract
Semiconductor memory failures depend on the behavior of its components. This paper deals with testing of defects occurring in the memory cells of a multi-port memory. We also consider the resistive shorts between word/bit lines of same and different ports of the memory. The memory is modeled at the transistor level and analyzed for electrical defects by applying a set of patterns. Not only have existing models been taken into account in our simulation but also a new fault model for the multi-port memory is introduced. The boundaries of failure for the proposed defects are identified. ũ 2001 IEEE.
| Original language | English |
|---|---|
| Pages (from-to) | 366-374 |
| Number of pages | 9 |
| Journal | IEEE International Workshop on Defect and Fault Tolerance in VLSI Systems |
| DOIs | |
| State | Published - 2001 |
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