TY - GEN
T1 - Damage of SAC405 solder joint under PDC
AU - Yao, Wei
AU - Basaran, Cemal
PY - 2012
Y1 - 2012
N2 - Pulse current induced electromigration (EM) damage of lead-free 95.5%Sn-4.0%Ag-0.5%Cu (SAC405) microelectronics solder joints has been investigated numerically. Solder joints were subjected to 0.05 Hz to 20 Hz pulse current loading with maximum current density varying between 10 5 A/cm 2 and 10 6 A/cm 2 at an ambient temperature of 353 °K. Entropy based damage evolution model was used in this work, which uses the irreversible entropy production rate as a measure of material damage. Thermal fluctuation period is 72s, which lags far behind the current loading period. Low cycle thermal fatigue may happen at current crowding corner. The EM induced damage develops exponentially during the whole loading history. It is observed that increasing duty factor and frequency leads to a faster damage accumulation. EM and thermomigration (TM) induced damage was found proportional to r 1.3, f 1.5 and j 2.3.
AB - Pulse current induced electromigration (EM) damage of lead-free 95.5%Sn-4.0%Ag-0.5%Cu (SAC405) microelectronics solder joints has been investigated numerically. Solder joints were subjected to 0.05 Hz to 20 Hz pulse current loading with maximum current density varying between 10 5 A/cm 2 and 10 6 A/cm 2 at an ambient temperature of 353 °K. Entropy based damage evolution model was used in this work, which uses the irreversible entropy production rate as a measure of material damage. Thermal fluctuation period is 72s, which lags far behind the current loading period. Low cycle thermal fatigue may happen at current crowding corner. The EM induced damage develops exponentially during the whole loading history. It is observed that increasing duty factor and frequency leads to a faster damage accumulation. EM and thermomigration (TM) induced damage was found proportional to r 1.3, f 1.5 and j 2.3.
KW - Electromigration damage
KW - PDC
KW - Thermal fatigue
UR - https://www.scopus.com/pages/publications/84866176479
U2 - 10.1109/ITHERM.2012.6231458
DO - 10.1109/ITHERM.2012.6231458
M3 - Conference contribution
AN - SCOPUS:84866176479
SN - 9781424495320
T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
SP - 403
EP - 407
BT - Proceedings of the 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
T2 - 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2012
Y2 - 30 May 2012 through 1 June 2012
ER -