Damage mechanics of solder joints under high current density

Cernal Basaran

doi:10.4028/0-87849-440-5.1403

Damage mechanics of solder joints under high current density

Cernal Basaran

Department of Civil, Structural & Environmental Engineering

Research output: Contribution to journal › Article › peer-review

Abstract

In this paper, Moiré interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joints under high density (10⁴A/cm²). An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts Moiré interferometry measurements in both spatial distribution and time history evolution, which indicates that the model is reasonably good for predicting the mechanical behavior of lead-free solder joints under electric current stressing.

Original language	English
Pages (from-to)	1403-1410
Number of pages	8
Journal	Key Engineering Materials
Volume	345-346 II
DOIs	https://doi.org/10.4028/0-87849-440-5.1403
State	Published - 2007

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title = "Damage mechanics of solder joints under high current density",

abstract = "In this paper, Moir{\'e} interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joints under high density (104A/cm2). An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts Moir{\'e} interferometry measurements in both spatial distribution and time history evolution, which indicates that the model is reasonably good for predicting the mechanical behavior of lead-free solder joints under electric current stressing.",

author = "Cernal Basaran",

year = "2007",

doi = "10.4028/0-87849-440-5.1403",

language = "English",

volume = "345-346 II",

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journal = "Key Engineering Materials",

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AU - Basaran, Cernal

PY - 2007

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N2 - In this paper, Moiré interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joints under high density (104A/cm2). An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts Moiré interferometry measurements in both spatial distribution and time history evolution, which indicates that the model is reasonably good for predicting the mechanical behavior of lead-free solder joints under electric current stressing.

AB - In this paper, Moiré interferometry technique is used to measure the in-situ displacement evolution of lead-free solder joints under high density (104A/cm2). An electromigration constitutive model is developed to simulate deformation of lead-free solder joint under current stressing. The simulation predicts Moiré interferometry measurements in both spatial distribution and time history evolution, which indicates that the model is reasonably good for predicting the mechanical behavior of lead-free solder joints under electric current stressing.

UR - https://www.scopus.com/pages/publications/34248513500

U2 - 10.4028/0-87849-440-5.1403

DO - 10.4028/0-87849-440-5.1403

M3 - Article

AN - SCOPUS:34248513500

SN - 1013-9826

VL - 345-346 II

SP - 1403

EP - 1410

JO - Key Engineering Materials

JF - Key Engineering Materials

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Damage mechanics of solder joints under high current density

Abstract

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