Abstract
Copper-matrix molybdenum particle composites containing 33 ~73 wt.% Mo were fabricated by hot pressing copper coated molybdenum powder. For comparison, corresponding composites fabricated by hot pressing a mixture of copper and molybdenum powders were also made. The former method gave composites of lower porosity, higher hardness, higher compressive yield strength, lower coefficient of thermal expansion, lower electrical resistivity and higher thermal conductivity than the latter method. These differences are partly due to the separation of the molybdenum particles by the copper coating in the former case. In contrast, molybdenum particle clustering occurred in the latter case when the Mo content exceeded 53 wt.%.
| Original language | English |
|---|---|
| Pages (from-to) | 841-851 |
| Number of pages | 11 |
| Journal | Journal of Electronic Materials |
| Volume | 24 |
| Issue number | 7 |
| DOIs | |
| State | Published - Jul 1995 |
Keywords
- Cu
- hot pressing
- Mo
- particulate composites
- sintering
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