@inproceedings{cd06530418974788a8b79401b6e502c0,
title = "Copper-matrix molybdenum particle composite as a low-thermal-expansion conductor",
abstract = "Power metallurgical fabrication of Cu/Mo composites containing 33-73 wt\% Mo was carried out by using either Cu coated Mo powder or a mixture of Cu and Mo powders. The former yielded Cu/Mo composites of greater density, hardness, compressive yield strength and abrasive wear resistance, and lower electrical resistivity and coefficient of thermal expansion than the latter.",
author = "Pay Yih and Chung, \{D. D.L.\}",
year = "1994",
language = "English",
isbn = "1558992227",
series = "Materials Research Society Symposium Proceedings",
publisher = "Publ by Materials Research Society",
pages = "189--193",
editor = "Peter Borgesen and Jensen, \{Klavs F.\} and Pollak, \{Roger A.\}",
booktitle = "Electronic Packaging Materials Science VII",
note = "Proceedings of the Fall 1993 MRS Meeting ; Conference date: 29-11-1993 Through 03-12-1993",
}