Copper-matrix composites of increased thermal conductivity and decreased thermal expansion provided by powder metallurgy processing of copper-coated molybdenum particles

Pay Yih; D. D.L. Chung

Copper-matrix composites of increased thermal conductivity and decreased thermal expansion provided by powder metallurgy processing of copper-coated molybdenum particles

Pay Yih
, D. D.L. Chung

Department of Mechanical and Aerospace Engineering

SUNY Buffalo

Research output: Contribution to conference › Paper › peer-review

Abstract

Copper-matrix composites were fabricated by powder metallurgy processing of copper-coated molybdenum particles. At 69.6 vol.% Mo, 28.9 vol.% Cu and 1.5 vol.% porosity, the composite exhibited coefficient of thermal expansion 7.4×10^-6 °C^-1 and thermal conductivity 146 W/(m.K). At 59.7 vol.% Mo, 39.6 vol.% Cu and 0.8 vol.% porosity, the composite exhibited coefficient of thermal expansion 8.4×10^-6 °C^-1 and thermal conductivity 191 W/(m.K). The coefficient of thermal expansion was higher, the thermal conductivity was lower and the porosity was higher in composites with the corresponding Mo weight fractions but fabricated by powder metallurgy processing of mixtures of copper and molybdenum particles.

Original language	English
Pages	266-270
Number of pages	5
State	Published - 1994
Event	Proceedings of the 1994 7th International SAMPE Electronics Conference - Parsippany, NJ, USA Duration: Jun 20 1994 → Jun 23 1994

Conference

Conference	Proceedings of the 1994 7th International SAMPE Electronics Conference
City	Parsippany, NJ, USA
Period	06/20/94 → 06/23/94

Cite this

@conference{933bc00c5cc84b68bb44fb1690a3943b,

title = "Copper-matrix composites of increased thermal conductivity and decreased thermal expansion provided by powder metallurgy processing of copper-coated molybdenum particles",

abstract = "Copper-matrix composites were fabricated by powder metallurgy processing of copper-coated molybdenum particles. At 69.6 vol.\% Mo, 28.9 vol.\% Cu and 1.5 vol.\% porosity, the composite exhibited coefficient of thermal expansion 7.4×10-6 °C-1 and thermal conductivity 146 W/(m.K). At 59.7 vol.\% Mo, 39.6 vol.\% Cu and 0.8 vol.\% porosity, the composite exhibited coefficient of thermal expansion 8.4×10-6 °C-1 and thermal conductivity 191 W/(m.K). The coefficient of thermal expansion was higher, the thermal conductivity was lower and the porosity was higher in composites with the corresponding Mo weight fractions but fabricated by powder metallurgy processing of mixtures of copper and molybdenum particles.",

author = "Pay Yih and Chung, \{D. D.L.\}",

year = "1994",

language = "English",

pages = "266--270",

note = "Proceedings of the 1994 7th International SAMPE Electronics Conference ; Conference date: 20-06-1994 Through 23-06-1994",

}

Copper-matrix composites of increased thermal conductivity and decreased thermal expansion provided by powder metallurgy processing of copper-coated molybdenum particles. / Yih, Pay; Chung, D. D.L.
1994. 266-270 Paper presented at Proceedings of the 1994 7th International SAMPE Electronics Conference, Parsippany, NJ, USA.

Research output: Contribution to conference › Paper › peer-review

TY - CONF

T1 - Copper-matrix composites of increased thermal conductivity and decreased thermal expansion provided by powder metallurgy processing of copper-coated molybdenum particles

AU - Yih, Pay

AU - Chung, D. D.L.

PY - 1994

Y1 - 1994

N2 - Copper-matrix composites were fabricated by powder metallurgy processing of copper-coated molybdenum particles. At 69.6 vol.% Mo, 28.9 vol.% Cu and 1.5 vol.% porosity, the composite exhibited coefficient of thermal expansion 7.4×10-6 °C-1 and thermal conductivity 146 W/(m.K). At 59.7 vol.% Mo, 39.6 vol.% Cu and 0.8 vol.% porosity, the composite exhibited coefficient of thermal expansion 8.4×10-6 °C-1 and thermal conductivity 191 W/(m.K). The coefficient of thermal expansion was higher, the thermal conductivity was lower and the porosity was higher in composites with the corresponding Mo weight fractions but fabricated by powder metallurgy processing of mixtures of copper and molybdenum particles.

AB - Copper-matrix composites were fabricated by powder metallurgy processing of copper-coated molybdenum particles. At 69.6 vol.% Mo, 28.9 vol.% Cu and 1.5 vol.% porosity, the composite exhibited coefficient of thermal expansion 7.4×10-6 °C-1 and thermal conductivity 146 W/(m.K). At 59.7 vol.% Mo, 39.6 vol.% Cu and 0.8 vol.% porosity, the composite exhibited coefficient of thermal expansion 8.4×10-6 °C-1 and thermal conductivity 191 W/(m.K). The coefficient of thermal expansion was higher, the thermal conductivity was lower and the porosity was higher in composites with the corresponding Mo weight fractions but fabricated by powder metallurgy processing of mixtures of copper and molybdenum particles.

UR - https://www.scopus.com/pages/publications/0028680063

M3 - Paper

AN - SCOPUS:0028680063

SP - 266

EP - 270

T2 - Proceedings of the 1994 7th International SAMPE Electronics Conference

Y2 - 20 June 1994 through 23 June 1994

ER -

Copper-matrix composites of increased thermal conductivity and decreased thermal expansion provided by powder metallurgy processing of copper-coated molybdenum particles

Abstract

Conference

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