TY - GEN
T1 - Control constrained resource partitioning for complex SoCs
AU - Zhao, Dan
AU - Upadhyaya, Shambhu
AU - Margala, Martin
N1 - Publisher Copyright:
© 2003 IEEE.
PY - 2003
Y1 - 2003
N2 - When moving into the billion-transistor era, the wired interconnects used in conventional SoC test control models are rather restricted in not only system performance, but also signal integrity and transmission with continued scaling of feature size. On the other hand, recent advances in silicon integrated circuit technology are making possible tiny low-cost transceivers to be integrated on chip. Based on the recent development in "radio-on-chip" technology, a new distributed multihop wireless test control network has been proposed. Under the multilevel tree structure, the system optimization is performed on control constrained resource partitioning and distribution. Several system design issues such as radio-frequency nodes placement, clustering and routing problems are studied, with the integrated resource distribution including not only the circuit blocks to perform testing, but also the on-chip radio-frequency nodes for intra-chip communication.
AB - When moving into the billion-transistor era, the wired interconnects used in conventional SoC test control models are rather restricted in not only system performance, but also signal integrity and transmission with continued scaling of feature size. On the other hand, recent advances in silicon integrated circuit technology are making possible tiny low-cost transceivers to be integrated on chip. Based on the recent development in "radio-on-chip" technology, a new distributed multihop wireless test control network has been proposed. Under the multilevel tree structure, the system optimization is performed on control constrained resource partitioning and distribution. Several system design issues such as radio-frequency nodes placement, clustering and routing problems are studied, with the integrated resource distribution including not only the circuit blocks to perform testing, but also the on-chip radio-frequency nodes for intra-chip communication.
UR - https://www.scopus.com/pages/publications/84971254553
U2 - 10.1109/TSM.2005.1250140
DO - 10.1109/TSM.2005.1250140
M3 - Conference contribution
AN - SCOPUS:84971254553
T3 - Proceedings - IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems
SP - 425
EP - 432
BT - Proceedings - 18th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, DFT 2003
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 18th IEEE International Symposium on Defect and Fault Tolerance in VLSI Systems, DFT 2003
Y2 - 3 November 2003 through 5 November 2003
ER -