| Original language | English |
|---|---|
| Pages | 17-24 |
| Number of pages | 8 |
| Volume | 10 |
| No | 5 |
| Specialist publication | Advanced Packaging |
| State | Published - 2001 |
Fingerprint
Dive into the research topics of 'Computer simulations of solder joint reliability tests'. Together they form a unique fingerprint.Cite this
- APA
- Author
- BIBTEX
- Harvard
- Standard
- RIS
- Vancouver