TY - GEN
T1 - Comparison of Input Range and Area-Power Tradeoff of Fully Segmented and Highly Segmented DEM Digital-to-Analog Converters
AU - Li, Hao
AU - Sahoo, Bibhu Datta
N1 - Publisher Copyright:
© 2025 IEEE.
PY - 2025
Y1 - 2025
N2 - 6G communication systems impose a higher demand on the linearity of digital-to-analog converters (DACs). Due to their excellent ability to eliminate non-linear distortions, tree-structured dynamic element matching (DEM) schemes, including fully segmented and highly segmented DEM, are expected to be used in DACs of 6G communication systems. This paper uses a 4-bit digital-to-analog converter (DAC) as a case study to evaluate and compare the input range, power consumption, and circuit complexity of fully segmented and highly segmented DEM (FS and HS-DEM) DACs. Additionally, it provides comprehensive comparison and area-power tradeoff analysis of FS and HS-DEM DACs with 8-bit, 10-bit, 12-bit, and 14-bit resolutions.
AB - 6G communication systems impose a higher demand on the linearity of digital-to-analog converters (DACs). Due to their excellent ability to eliminate non-linear distortions, tree-structured dynamic element matching (DEM) schemes, including fully segmented and highly segmented DEM, are expected to be used in DACs of 6G communication systems. This paper uses a 4-bit digital-to-analog converter (DAC) as a case study to evaluate and compare the input range, power consumption, and circuit complexity of fully segmented and highly segmented DEM (FS and HS-DEM) DACs. Additionally, it provides comprehensive comparison and area-power tradeoff analysis of FS and HS-DEM DACs with 8-bit, 10-bit, 12-bit, and 14-bit resolutions.
KW - 6G communication
KW - digital-to-analog converter (DAC)
KW - dy-namic element matching (DEM)
KW - non-linear distortions
UR - https://www.scopus.com/pages/publications/105029749897
U2 - 10.1109/MWSCAS53549.2025.11244486
DO - 10.1109/MWSCAS53549.2025.11244486
M3 - Conference contribution
AN - SCOPUS:105029749897
T3 - Midwest Symposium on Circuits and Systems
SP - 323
EP - 326
BT - 2025 IEEE 68th International Midwest Symposium on Circuits and Systems, MWSCAS 2025
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 68th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2025
Y2 - 10 August 2025 through 13 August 2025
ER -