Abstract
In GaN/(Al,Ga)N high-electron-mobility transistors (HEMT), AlN interlayer between GaN channel and AlGaN barrier suppresses alloy scattering and significantly improves the electron mobility of the two-dimensional electron gas. While high concentrations of gallium were previously observed in Al-polar AlN interlayers grown by metal-organic chemical vapor deposition, the N-polar AlN (Al x Ga1-xN) films examined by atom probe tomography in this study exhibited aluminum compositions (x) equal to or higher than 95% over a wide range of growth conditions. The also investigated AlN interlayer in a N-polar GaN/AlN/AlGaN/ S.I. GaN HEMT structure possessed a similarly high x content.
| Original language | English |
|---|---|
| Article number | 115004 |
| Journal | Semiconductor Science and Technology |
| Volume | 32 |
| Issue number | 11 |
| DOIs | |
| State | Published - Sep 29 2017 |
Keywords
- AlGaN
- AlN
- atom probe tomography
- GaN
- metal-organic chemical vapor deposition
- N face
- N polar
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