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Characterization of N-polar AlN in GaN/AlN/(Al,Ga)N heterostructures grown by metal-organic chemical vapor deposition

  • Haoran Li
  • , Baishakhi Mazumder
  • , Bastien Bonef
  • , Stacia Keller
  • , Steven Wienecke
  • , James S. Speck
  • , Steven P. Denbaars
  • , Umesh K. Mishra
  • University of California at Santa Barbara

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

In GaN/(Al,Ga)N high-electron-mobility transistors (HEMT), AlN interlayer between GaN channel and AlGaN barrier suppresses alloy scattering and significantly improves the electron mobility of the two-dimensional electron gas. While high concentrations of gallium were previously observed in Al-polar AlN interlayers grown by metal-organic chemical vapor deposition, the N-polar AlN (Al x Ga1-xN) films examined by atom probe tomography in this study exhibited aluminum compositions (x) equal to or higher than 95% over a wide range of growth conditions. The also investigated AlN interlayer in a N-polar GaN/AlN/AlGaN/ S.I. GaN HEMT structure possessed a similarly high x content.

Original languageEnglish
Article number115004
JournalSemiconductor Science and Technology
Volume32
Issue number11
DOIs
StatePublished - Sep 29 2017

Keywords

  • AlGaN
  • AlN
  • atom probe tomography
  • GaN
  • metal-organic chemical vapor deposition
  • N face
  • N polar

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