Abstract
Wax (predominantly tricosane paraffin wax, with a melting temperature of 48°C) filled with hexagonal boron nitride (BN) particles (5-11 μm) was found to be an effective phase-change thermal interface material. The thermal contact conductance, as measured with the interface material between copper surfaces, decreased with increasing temperature from 22 to 48°C, but increased with increasing temperature from 48 to 55&C. The melting of the wax enhanced the conductance, due to increased conformability to the mating surfaces. For a given BN volume fraction and a given temperature, the thermal contact conductance increased with increasing contact pressure. However, a pressure above 0.30 MPa resulted in no significant increase in the conductance. The conductance increased with BN content up to 6.2 vol. %, but decreased upon further increase to 8.6 vol. %. The highest conductance above the melting temperature was 18 × 104 W/m2.°C, as attained for a BN content of 4.0 vol. % at 55°C and 0.30 MPa. Below the melting temperature, the highest conductance was 19 × 104 W/m 2.°C, as attained for a BN content of 6.2 vol. % at 22°C and 0.30 MPa.
| Original language | English |
|---|---|
| Pages (from-to) | 319-323 |
| Number of pages | 5 |
| Journal | Journal of Electronic Packaging |
| Volume | 128 |
| Issue number | 4 |
| DOIs | |
| State | Published - Dec 2006 |
Keywords
- Boron nitride
- Conductance
- Paraffin wax
- Phase change
- Pressure
- Thermal contact
- Thermal interface
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