APPLICATION OF THERMAL X-RAY DIFFRACTION IN ELECTRONIC MATERIALS RESEARCH.

D. D.L. Chung

APPLICATION OF THERMAL X-RAY DIFFRACTION IN ELECTRONIC MATERIALS RESEARCH.

D. D.L. Chung

Department of Mechanical and Aerospace Engineering

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

2 Scopus citations

Abstract

Thermal x-ray diffraction is found to be valuable for characterizing structural changes, such as alloying, reaction, recrystallization and phase transformation, which occur upon heating electronic materials. This paper introduces thermal x-ray diffraction as a major thermoanalytical technique in materials research. The technique is illustrated by a study of the interfacial processes between metals and gallium arsenide.

Original language	English
Title of host publication	Unknown Host Publication Title
Editors	Bernard Miller
Publisher	John Wiley & Sons
Pages	1392-1401
Number of pages	10
ISBN (Print)	0471262455
State	Published - 1982

Cite this

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title = "APPLICATION OF THERMAL X-RAY DIFFRACTION IN ELECTRONIC MATERIALS RESEARCH.",

abstract = "Thermal x-ray diffraction is found to be valuable for characterizing structural changes, such as alloying, reaction, recrystallization and phase transformation, which occur upon heating electronic materials. This paper introduces thermal x-ray diffraction as a major thermoanalytical technique in materials research. The technique is illustrated by a study of the interfacial processes between metals and gallium arsenide.",

author = "Chung, \{D. D.L.\}",

year = "1982",

language = "English",

isbn = "0471262455",

publisher = "John Wiley \& Sons",

pages = "1392--1401",

editor = "Bernard Miller",

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TY - GEN

T1 - APPLICATION OF THERMAL X-RAY DIFFRACTION IN ELECTRONIC MATERIALS RESEARCH.

AU - Chung, D. D.L.

PY - 1982

Y1 - 1982

N2 - Thermal x-ray diffraction is found to be valuable for characterizing structural changes, such as alloying, reaction, recrystallization and phase transformation, which occur upon heating electronic materials. This paper introduces thermal x-ray diffraction as a major thermoanalytical technique in materials research. The technique is illustrated by a study of the interfacial processes between metals and gallium arsenide.

AB - Thermal x-ray diffraction is found to be valuable for characterizing structural changes, such as alloying, reaction, recrystallization and phase transformation, which occur upon heating electronic materials. This paper introduces thermal x-ray diffraction as a major thermoanalytical technique in materials research. The technique is illustrated by a study of the interfacial processes between metals and gallium arsenide.

UR - https://www.scopus.com/pages/publications/0020217504

M3 - Conference contribution

AN - SCOPUS:0020217504

SN - 0471262455

SP - 1392

EP - 1401

BT - Unknown Host Publication Title

A2 - Miller, Bernard

PB - John Wiley & Sons

ER -

APPLICATION OF THERMAL X-RAY DIFFRACTION IN ELECTRONIC MATERIALS RESEARCH.

Abstract

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