An in-situ study of copper electropolishing in phosphoric acid solution

Deyu Li; Ning Li; Guofeng Xia; Zhen Zheng; Jialin Wang; Ning Xiao; Wenjie Zhai; Gang Wu

doi:10.1016/s1452-3981(23)14078-8

An in-situ study of copper electropolishing in phosphoric acid solution

Deyu Li
, Ning Li
, Guofeng Xia
, Zhen Zheng
, Jialin Wang
, Ning Xiao
, Wenjie Zhai
, Gang Wu

Department of Chemical and Biological Engineering

Harbin Institute of Technology

Research output: Contribution to journal › Article › peer-review

18 Scopus citations

Abstract

In this work, the interface film in the Cu/H₃PO₄ interface was in-situ studied by tracking the time and potential evolution of the system impedance (Rs) at high-frequency. The fluctuation of Rs upon the applied potentials was confirmed by the Rs-potential plot. A copper oxide film was found formed on the copper surface during the electropolishing process by analyzing the Mott-Schottky curve. Moreover, the copper oxides film exhibited a transition of n-type semiconductor to a p-type one.

Original language	English
Pages (from-to)	1041-1046
Number of pages	6
Journal	International Journal of Electrochemical Science
Volume	8
Issue number	1
DOIs	https://doi.org/10.1016/s1452-3981(23)14078-8
State	Published - Jan 2013

Keywords

Copper
ECMP
Electrochemical analysis
Electrolytic polishing
Planarization
Surface chemistry

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10.1016/s1452-3981(23)14078-8

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title = "An in-situ study of copper electropolishing in phosphoric acid solution",

abstract = "In this work, the interface film in the Cu/H3PO4 interface was in-situ studied by tracking the time and potential evolution of the system impedance (Rs) at high-frequency. The fluctuation of Rs upon the applied potentials was confirmed by the Rs-potential plot. A copper oxide film was found formed on the copper surface during the electropolishing process by analyzing the Mott-Schottky curve. Moreover, the copper oxides film exhibited a transition of n-type semiconductor to a p-type one.",

keywords = "Copper, ECMP, Electrochemical analysis, Electrolytic polishing, Planarization, Surface chemistry",

author = "Deyu Li and Ning Li and Guofeng Xia and Zhen Zheng and Jialin Wang and Ning Xiao and Wenjie Zhai and Gang Wu",

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T1 - An in-situ study of copper electropolishing in phosphoric acid solution

AU - Li, Deyu

AU - Li, Ning

AU - Xia, Guofeng

AU - Zheng, Zhen

AU - Wang, Jialin

AU - Xiao, Ning

AU - Zhai, Wenjie

AU - Wu, Gang

PY - 2013/1

Y1 - 2013/1

N2 - In this work, the interface film in the Cu/H3PO4 interface was in-situ studied by tracking the time and potential evolution of the system impedance (Rs) at high-frequency. The fluctuation of Rs upon the applied potentials was confirmed by the Rs-potential plot. A copper oxide film was found formed on the copper surface during the electropolishing process by analyzing the Mott-Schottky curve. Moreover, the copper oxides film exhibited a transition of n-type semiconductor to a p-type one.

AB - In this work, the interface film in the Cu/H3PO4 interface was in-situ studied by tracking the time and potential evolution of the system impedance (Rs) at high-frequency. The fluctuation of Rs upon the applied potentials was confirmed by the Rs-potential plot. A copper oxide film was found formed on the copper surface during the electropolishing process by analyzing the Mott-Schottky curve. Moreover, the copper oxides film exhibited a transition of n-type semiconductor to a p-type one.

KW - Copper

KW - ECMP

KW - Electrochemical analysis

KW - Electrolytic polishing

KW - Planarization

KW - Surface chemistry

UR - https://www.scopus.com/pages/publications/84873857768

U2 - 10.1016/s1452-3981(23)14078-8

DO - 10.1016/s1452-3981(23)14078-8

M3 - Article

AN - SCOPUS:84873857768

SN - 1452-3981

VL - 8

SP - 1041

EP - 1046

JO - International Journal of Electrochemical Science

JF - International Journal of Electrochemical Science

IS - 1

ER -

An in-situ study of copper electropolishing in phosphoric acid solution

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Keywords

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