@inproceedings{762dfea8b8b6480db71855988275272e,
title = "An Echo-Cancellation Hybrid Transceiver for Full-Duplex Signaling in 3D-Stacked ICs",
abstract = "In this paper, an echo-cancellation based hybrid is proposed for simultaneous-bidirectional (SBD) signaling in wireless thru-chip interface (TCI) for 3-D stacked ICs. In case of conventional unidirectional (UD) signaling, separate TCIs for transmitting and receiving data are used. Further with increase in communication distance, the inductor diameter should be increased to maintain the coupling coefficient which increases the quality factor and induces ringing. As a result, the UD signaling limits the data-rate per unit area for a given communication distance. The proposed transceiver incorporates SBD signaling by using a hybrid topology to extract the received signal by cancelling the transmitted signal in the TCI. By this approach the data-rate per unit area has increased by 10\% for 1e-9 biterror rate with sampling jitter of 5 ps. The architecture has been implemented using TSMC PDK in 65 nm technology for a communication distance of 25 μ m. It achieves a SBD data-rate of 20Gb/s with an energy-efficiency 1.75 pJ/b.",
keywords = "3D-Stacked ICs, bidirectional signaling, echo-cancellation, thruchip interface, unidirectional signaling",
author = "Soumojit Bakshi and Surya, \{V. K.\} and Sahoo, \{Bibhu Datta\} and Nijwm Wary",
note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 68th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2025 ; Conference date: 10-08-2025 Through 13-08-2025",
year = "2025",
doi = "10.1109/MWSCAS53549.2025.11244568",
language = "English",
series = "Midwest Symposium on Circuits and Systems",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
pages = "356--360",
booktitle = "2025 IEEE 68th International Midwest Symposium on Circuits and Systems, MWSCAS 2025",
address = "United States",
}