An analytical model for thermal stress analysis of multi-layered microelectronic packaging

Wen Yujun; Cernai Basaran

doi:10.1109/HDP.2005.251400

An analytical model for thermal stress analysis of multi-layered microelectronic packaging

Wen Yujun
, Cernai Basaran

Department of Civil, Structural & Environmental Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Compared to numerical methods, analytical solutions can offer a faster and more accurate procedure for obtaining the interfacial stresses in laminated structures. An analytical model for thermal stress analysis of multilayered thin stacks on a thick substrate under isothermal loading is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. Highly sensitive MoirÉ interferometry is used to validate the model. The strain field in the bimaterial interfaces is obtained experimentally. The test data is in good agreement with the proposed analytical solution. Finite element analysis results are also compared with the analytical solution and the test data.

Original language	English
Title of host publication	2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
DOIs	https://doi.org/10.1109/HDP.2005.251400
State	Published - 2006
Event	2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 - Shanghai, China Duration: Jun 27 2005 → Jun 29 2005

Publication series

Name	2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Conference

Conference	2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05
Country/Territory	China
City	Shanghai
Period	06/27/05 → 06/29/05

Keywords

Interfacial delamination
Interfacial stress
Microelectronic packaging
Moiré interferometry
Multilayered structure

Access to Document

10.1109/HDP.2005.251400

Cite this

Yujun, W., & Basaran, C. (2006). An analytical model for thermal stress analysis of multi-layered microelectronic packaging. In 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 Article 4017441 (2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05). https://doi.org/10.1109/HDP.2005.251400

@inproceedings{37b2b335018349858054df8af27bf009,

title = "An analytical model for thermal stress analysis of multi-layered microelectronic packaging",

abstract = "Compared to numerical methods, analytical solutions can offer a faster and more accurate procedure for obtaining the interfacial stresses in laminated structures. An analytical model for thermal stress analysis of multilayered thin stacks on a thick substrate under isothermal loading is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. Highly sensitive Moir{\'E} interferometry is used to validate the model. The strain field in the bimaterial interfaces is obtained experimentally. The test data is in good agreement with the proposed analytical solution. Finite element analysis results are also compared with the analytical solution and the test data.",

keywords = "Interfacial delamination, Interfacial stress, Microelectronic packaging, Moir{\'e} interferometry, Multilayered structure",

author = "Wen Yujun and Cernai Basaran",

year = "2006",

doi = "10.1109/HDP.2005.251400",

language = "English",

isbn = "0780392930",

series = "2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05",

booktitle = "2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05",

note = "2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05 ; Conference date: 27-06-2005 Through 29-06-2005",

}

Yujun, W & Basaran, C 2006, An analytical model for thermal stress analysis of multi-layered microelectronic packaging. in 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05., 4017441, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05, Shanghai, China, 06/27/05. https://doi.org/10.1109/HDP.2005.251400

An analytical model for thermal stress analysis of multi-layered microelectronic packaging. / Yujun, Wen; Basaran, Cernai.
2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05. 2006. 4017441 (2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

TY - GEN

T1 - An analytical model for thermal stress analysis of multi-layered microelectronic packaging

AU - Yujun, Wen

AU - Basaran, Cernai

PY - 2006

Y1 - 2006

N2 - Compared to numerical methods, analytical solutions can offer a faster and more accurate procedure for obtaining the interfacial stresses in laminated structures. An analytical model for thermal stress analysis of multilayered thin stacks on a thick substrate under isothermal loading is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. Highly sensitive MoirÉ interferometry is used to validate the model. The strain field in the bimaterial interfaces is obtained experimentally. The test data is in good agreement with the proposed analytical solution. Finite element analysis results are also compared with the analytical solution and the test data.

AB - Compared to numerical methods, analytical solutions can offer a faster and more accurate procedure for obtaining the interfacial stresses in laminated structures. An analytical model for thermal stress analysis of multilayered thin stacks on a thick substrate under isothermal loading is proposed in this paper. This analytical approach considers each layer as a beam-type plate with orthotropic material properties. Highly sensitive MoirÉ interferometry is used to validate the model. The strain field in the bimaterial interfaces is obtained experimentally. The test data is in good agreement with the proposed analytical solution. Finite element analysis results are also compared with the analytical solution and the test data.

KW - Interfacial delamination

KW - Interfacial stress

KW - Microelectronic packaging

KW - Moiré interferometry

KW - Multilayered structure

UR - https://www.scopus.com/pages/publications/37649026457

U2 - 10.1109/HDP.2005.251400

DO - 10.1109/HDP.2005.251400

M3 - Conference contribution

AN - SCOPUS:37649026457

SN - 0780392930

SN - 9780780392939

T3 - 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

BT - 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

T2 - 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05

Y2 - 27 June 2005 through 29 June 2005

ER -

Yujun W, Basaran C. An analytical model for thermal stress analysis of multi-layered microelectronic packaging. In 2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05. 2006. 4017441. (2005 Conference on High Density Microsystem Design and Packaging and Component Failure Analysis, HDP'05). doi: 10.1109/HDP.2005.251400

An analytical model for thermal stress analysis of multi-layered microelectronic packaging

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