Aluminum nitride particle filled aluminum as a thermal conductor of low thermal expansion

S. W. Lai; D. D.L. Chung

Aluminum nitride particle filled aluminum as a thermal conductor of low thermal expansion

S. W. Lai
, D. D.L. Chung

Department of Mechanical and Aerospace Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

1 Scopus citations

Abstract

Aluminum-matrix composites containing aluminum nitride particles exhibited higher ductility, greater shear strength and superior high temperature resistance compared to those containing silicon carbide particles. This is due to the reactivity between SiC and Al and the nonreactivity between AlN and Al. Both Al/AlN and Al/SiC composites are useful as thermal conductors of low thermal expansion.

Original language	English
Title of host publication	International SAMPE Electronics Conference
Pages	459-465
Number of pages	7
Volume	6
State	Published - 1992
Event	6th International SAMPE Electronics Conference - Baltimore, MD, USA Duration: Jun 22 1992 → Jun 25 1992

Conference

Conference	6th International SAMPE Electronics Conference
City	Baltimore, MD, USA
Period	06/22/92 → 06/25/92

Cite this

@inproceedings{cd226a4fcd684a9fa963b42090b0417e,

title = "Aluminum nitride particle filled aluminum as a thermal conductor of low thermal expansion",

abstract = "Aluminum-matrix composites containing aluminum nitride particles exhibited higher ductility, greater shear strength and superior high temperature resistance compared to those containing silicon carbide particles. This is due to the reactivity between SiC and Al and the nonreactivity between AlN and Al. Both Al/AlN and Al/SiC composites are useful as thermal conductors of low thermal expansion.",

author = "Lai, \{S. W.\} and Chung, \{D. D.L.\}",

year = "1992",

language = "English",

isbn = "0938994654",

volume = "6",

pages = "459--465",

booktitle = "International SAMPE Electronics Conference",

note = "6th International SAMPE Electronics Conference ; Conference date: 22-06-1992 Through 25-06-1992",

}

TY - GEN

T1 - Aluminum nitride particle filled aluminum as a thermal conductor of low thermal expansion

AU - Lai, S. W.

AU - Chung, D. D.L.

PY - 1992

Y1 - 1992

N2 - Aluminum-matrix composites containing aluminum nitride particles exhibited higher ductility, greater shear strength and superior high temperature resistance compared to those containing silicon carbide particles. This is due to the reactivity between SiC and Al and the nonreactivity between AlN and Al. Both Al/AlN and Al/SiC composites are useful as thermal conductors of low thermal expansion.

AB - Aluminum-matrix composites containing aluminum nitride particles exhibited higher ductility, greater shear strength and superior high temperature resistance compared to those containing silicon carbide particles. This is due to the reactivity between SiC and Al and the nonreactivity between AlN and Al. Both Al/AlN and Al/SiC composites are useful as thermal conductors of low thermal expansion.

UR - https://www.scopus.com/pages/publications/0027061584

M3 - Conference contribution

AN - SCOPUS:0027061584

SN - 0938994654

VL - 6

SP - 459

EP - 465

BT - International SAMPE Electronics Conference

T2 - 6th International SAMPE Electronics Conference

Y2 - 22 June 1992 through 25 June 1992

ER -

Aluminum nitride particle filled aluminum as a thermal conductor of low thermal expansion

Abstract

Conference

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