@inproceedings{45dec00fe18140d7b0b1cb2b763dd06d,
title = "Aluminum-matrix aluminum nitride particle composite as a low-thermal-expansion thermal conductors",
abstract = "Aluminum-matrix composites containing AlN or SiC particles were fabricated by vacuum infiltration of liquid aluminum into a porous particulate preform under an argon pressure of up to 41 MPa. Al/AlN was superior to Al/SiC in thermal conductivity.",
author = "Lai, \{Shy Wen\} and Chung, \{D. D.L.\}",
year = "1994",
language = "English",
isbn = "1558992227",
series = "Materials Research Society Symposium Proceedings",
publisher = "Publ by Materials Research Society",
pages = "207--212",
editor = "Peter Borgesen and Jensen, \{Klavs F.\} and Pollak, \{Roger A.\}",
booktitle = "Electronic Packaging Materials Science VII",
note = "Proceedings of the Fall 1993 MRS Meeting ; Conference date: 29-11-1993 Through 03-12-1993",
}