TY - GEN
T1 - Active gate control for series connected SiC MOSFETs
AU - Lee, Inhwan
AU - Yao, Xiu
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/5/24
Y1 - 2019/5/24
N2 - Silicon (Si) is the most widely used in power electronic devices. However, due to its limitations regarding switching frequency and blocking voltage, wide band gap (WBG) materials have been under extensive research. Especially, Silicon carbide (SiC) device is expected to replace the Si device in many high voltage/power application. However, the commercially available SiC devices need to be improved to achieve higher voltage rating. To achieve high voltage and power, series connection of devices is promising alternative. Despite of the advantage of series connection, it causes critical issue which is voltage unbalance that harms the devices. Therefore, the voltage balancing control must be performed in devices series connection. In this paper, the active gate driver (AGD) control method is proposed to balance the voltages. A gate resistance modulation method is applied for dynamic voltage sharing. The proposed method is verified in LTspice siumlation.
AB - Silicon (Si) is the most widely used in power electronic devices. However, due to its limitations regarding switching frequency and blocking voltage, wide band gap (WBG) materials have been under extensive research. Especially, Silicon carbide (SiC) device is expected to replace the Si device in many high voltage/power application. However, the commercially available SiC devices need to be improved to achieve higher voltage rating. To achieve high voltage and power, series connection of devices is promising alternative. Despite of the advantage of series connection, it causes critical issue which is voltage unbalance that harms the devices. Therefore, the voltage balancing control must be performed in devices series connection. In this paper, the active gate driver (AGD) control method is proposed to balance the voltages. A gate resistance modulation method is applied for dynamic voltage sharing. The proposed method is verified in LTspice siumlation.
UR - https://www.scopus.com/pages/publications/85067127239
U2 - 10.1109/APEC.2019.8722292
DO - 10.1109/APEC.2019.8722292
M3 - Conference contribution
AN - SCOPUS:85067127239
T3 - Conference Proceedings - IEEE Applied Power Electronics Conference and Exposition - APEC
SP - 453
EP - 457
BT - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 34th Annual IEEE Applied Power Electronics Conference and Exposition, APEC 2019
Y2 - 17 March 2019 through 21 March 2019
ER -