Abstract
A silver-based active (titanium-containing) brazing alloy, namely 63Ag-34.25Cu-1.75Ti-1.OSn, was found to serve as a totally metal (no glass) thick film conductor which exhibited lower electrical resistivity, much greater film/substrate adhesion, much lower porosity, similar solderability, and lower scratch resistance compared to the conventional silver-glass thick film. The brazing alloy film was formed by screen printing a paste containing the alloy particles and then firing at 880°C in vacuum.
| Original language | English |
|---|---|
| Pages (from-to) | 541-549 |
| Number of pages | 9 |
| Journal | Journal of Electronic Materials |
| Volume | 23 |
| Issue number | 6 |
| DOIs | |
| State | Published - Jun 1994 |
Keywords
- Active brazing alloy
- metal thick film conductor
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