Abstract
A silver-based active (titanium-containing) brazing alloy, namely 63Ag-34.25Cu-1.75Ti-1.0Sn, was found to serve as a totally metal (no glass) thick film conductor which exhibited lower electrical resistivity, much greater film/substrate adhesion, much lower porosity, similar solderability and lower scratch resistance compared to the conventional silver-glass thick film. The brazing alloy film was formed by screen printing a paste containing the alloy particles and then firing at 880°C in vacuum.
| Original language | English |
|---|---|
| Pages | 120-126 |
| Number of pages | 7 |
| State | Published - 1994 |
| Event | Proceedings of the 1994 7th International SAMPE Electronics Conference - Parsippany, NJ, USA Duration: Jun 20 1994 → Jun 23 1994 |
Conference
| Conference | Proceedings of the 1994 7th International SAMPE Electronics Conference |
|---|---|
| City | Parsippany, NJ, USA |
| Period | 06/20/94 → 06/23/94 |
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