TY - GEN
T1 - A Wearable Flexible Hybrid Electronics ECG Monitor
AU - Poliks, Mark
AU - Turner, James
AU - Ghose, Kanad
AU - Jin, Zhanpeng
AU - Garg, Mohit
AU - Gui, Qiong
AU - Arias, Ana
AU - Kahn, Yasser
AU - Schadt, Mark
AU - Egitto, Frank
N1 - Publisher Copyright:
© 2016 IEEE.
PY - 2016/8/16
Y1 - 2016/8/16
N2 - Flexible hybrid electronics (FHE) integrate both traditional printed circuits, solder assembled standard and thinned silicon chips along with printable electronic materials and sensors. The combination results in high performance from thin, light weight, flexible devices that potentially could be manufactured at low cost. In this paper, flexible hybrid electronics technology is being used to develop a wearable ECG and skin temperature monitor. All components and materials were commercially available, and all fabrication processes were executed in manufacturing environments. The monitor is composed of a flexible polyimide substrate with printed ECG electrodes, a printed thermistor, and connecting traces printed on one surface, and the electronic components mounted on other. Both sides have copper metal circuits connected by copper plated through hole vias (THV). ECG signals are amplified, preconditioned and wirelessly transmitted via Bluetooth to a nearby handheld mobile phone or computer. The wearable monitor is 2x2 inches in size and has been demonstrated to produce high fidelity ECG signals at the host from both certified archived human ECG signals and ECG signals from human volunteers. The monitor reproduced the archived signals at the host from which a set of clinical parameters were calculated that closely matched those of the archived signals. Manufacturing challenges and device reliability will be discussed. Current work includes building upon this platform and integration of other monitoring and sensor devices included those that monitor for biomarkers in sweat. This work was sponsored by the NanoBio Manufacturing Consortium administered by the Flextech Alliance and funded by the US Air Force Research Laboratory.
AB - Flexible hybrid electronics (FHE) integrate both traditional printed circuits, solder assembled standard and thinned silicon chips along with printable electronic materials and sensors. The combination results in high performance from thin, light weight, flexible devices that potentially could be manufactured at low cost. In this paper, flexible hybrid electronics technology is being used to develop a wearable ECG and skin temperature monitor. All components and materials were commercially available, and all fabrication processes were executed in manufacturing environments. The monitor is composed of a flexible polyimide substrate with printed ECG electrodes, a printed thermistor, and connecting traces printed on one surface, and the electronic components mounted on other. Both sides have copper metal circuits connected by copper plated through hole vias (THV). ECG signals are amplified, preconditioned and wirelessly transmitted via Bluetooth to a nearby handheld mobile phone or computer. The wearable monitor is 2x2 inches in size and has been demonstrated to produce high fidelity ECG signals at the host from both certified archived human ECG signals and ECG signals from human volunteers. The monitor reproduced the archived signals at the host from which a set of clinical parameters were calculated that closely matched those of the archived signals. Manufacturing challenges and device reliability will be discussed. Current work includes building upon this platform and integration of other monitoring and sensor devices included those that monitor for biomarkers in sweat. This work was sponsored by the NanoBio Manufacturing Consortium administered by the Flextech Alliance and funded by the US Air Force Research Laboratory.
KW - BioCompatible and Medical Packaging
KW - BioSensor Packaging
KW - Flexible Substrates & Interconnection Solutions
KW - Interconnects for BioMedical
KW - Novel Assembly Technologies
KW - Wearable and Medical Electronics
UR - https://www.scopus.com/pages/publications/84987781438
U2 - 10.1109/ECTC.2016.395
DO - 10.1109/ECTC.2016.395
M3 - Conference contribution
AN - SCOPUS:84987781438
T3 - Proceedings - Electronic Components and Technology Conference
SP - 1623
EP - 1631
BT - Proceedings - ECTC 2016
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 66th IEEE Electronic Components and Technology Conference, ECTC 2016
Y2 - 31 May 2016 through 3 June 2016
ER -