A transmission electron microscopy study of intermetallic formation in aluminium-copper thin-film couples

K. Rajan; E. R. Wallach

doi:10.1016/0022-0248(80)90164-5

A transmission electron microscopy study of intermetallic formation in aluminium-copper thin-film couples

K. Rajan
, E. R. Wallach

Department of Materials Design and Innovation

University of Cambridge

Research output: Contribution to journal › Article › peer-review

43 Scopus citations

Abstract

The sequence of interfacial intermetallic nucleation in aluminum-copper thin-film couples, determined using transmission electron microscopy, is described. By measurement of lattice spacing (using moiré-fringes and by microdiffraction), it was found that only the two intermetallics CuAl₂ and Cu₉Al₄ formed at 500°C.

Original language	English
Pages (from-to)	297-302
Number of pages	6
Journal	Journal of Crystal Growth
Volume	49
Issue number	2
DOIs	https://doi.org/10.1016/0022-0248(80)90164-5
State	Published - Jun 1980

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title = "A transmission electron microscopy study of intermetallic formation in aluminium-copper thin-film couples",

abstract = "The sequence of interfacial intermetallic nucleation in aluminum-copper thin-film couples, determined using transmission electron microscopy, is described. By measurement of lattice spacing (using moir{\'e}-fringes and by microdiffraction), it was found that only the two intermetallics CuAl2 and Cu9Al4 formed at 500°C.",

author = "K. Rajan and Wallach, \{E. R.\}",

year = "1980",

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T1 - A transmission electron microscopy study of intermetallic formation in aluminium-copper thin-film couples

AU - Rajan, K.

AU - Wallach, E. R.

PY - 1980/6

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N2 - The sequence of interfacial intermetallic nucleation in aluminum-copper thin-film couples, determined using transmission electron microscopy, is described. By measurement of lattice spacing (using moiré-fringes and by microdiffraction), it was found that only the two intermetallics CuAl2 and Cu9Al4 formed at 500°C.

AB - The sequence of interfacial intermetallic nucleation in aluminum-copper thin-film couples, determined using transmission electron microscopy, is described. By measurement of lattice spacing (using moiré-fringes and by microdiffraction), it was found that only the two intermetallics CuAl2 and Cu9Al4 formed at 500°C.

UR - https://www.scopus.com/pages/publications/0012853267

U2 - 10.1016/0022-0248(80)90164-5

DO - 10.1016/0022-0248(80)90164-5

M3 - Article

AN - SCOPUS:0012853267

SN - 0022-0248

VL - 49

SP - 297

EP - 302

JO - Journal of Crystal Growth

JF - Journal of Crystal Growth

IS - 2

ER -

A transmission electron microscopy study of intermetallic formation in aluminium-copper thin-film couples

Abstract

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