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A three-dimensionally interconnected metal-spring network in a silicone matrix as a resilient and electrically conducting composite material

  • SUNY Buffalo

Research output: Contribution to journalArticlepeer-review

9 Scopus citations

Abstract

Isotropic, highly resilient and electrically conducting composites in the form of a copper-spring three-dimensional network embedded in a silicone matrix were developed for use as electrical and thermal contact materials. The springs were made from 63 μm diameter copper wires and were coated and interconnected by Sn-Pb solder. The springs used were long coils, intersecting and interconnected to one another to form a three-dimensional network. Composites were fabricated by infiltration of a silicone resin into a preform of springs. A volume resistivity of 5 × 10-4 Ω cm, a contact resistivity with copper of 0.016 Ω cm2 at ≥ 0.03 MPa, and a permanent set of 0.6% after compresssion at 0.4 MPa were achieved in a silicone-matrix composite containing 3.1 volume% Cu springs and 2.9 volume% solder (i.e., 6.00 volume% total filler); the volume resistivity was not affected by heating in air at 130-150°C for 7 days, nor by immersion in water for 7 days. The volume resistivity values of composites containing from 4.17 to 6.00 volume% total filler were equal to three times the corresponding calculated values for composites containing unidirectional and continuous fibres, indicating that the filler was indeed a continuous three-dimensional network.

Original languageEnglish
Pages (from-to)355-363
Number of pages9
JournalComposites
Volume23
Issue number5
DOIs
StatePublished - Sep 1992

Keywords

  • composite materials
  • contact electrical resistivity, three-dimensional interconnected network
  • copper springs
  • silicone matrix
  • tin-lead solder
  • volume electrical resistivity

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