A T-DEM Based High-Speed Time-Interleaved Digital-to-Analog Converter

Hao Li; Bibhu Datta Sahoo

doi:10.1109/MWSCAS53549.2025.11244517

A T-DEM Based High-Speed Time-Interleaved Digital-to-Analog Converter

Hao Li
, Bibhu Datta Sahoo

Department of Electrical Engineering

SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

Abstract

6G communication systems impose higher demands on the data sampling rate and linearity of digital-to-analog converters (DACs). This paper proposes a time-interleaved digital-to-analog converter (TI-DAC) design, applying tree-structured dynamic element matching (DEM) to TI-DAC, which significantly enhances the spurious-free dynamic range (SFDR). Simulation results in the Simulink environment demonstrate that the proposed TI-DAC with time-domain dynamic element matching (TDEM) improves both the data conversion speed and the SFDR of DACs, providing an effective solution for high-performance signal conversion in 6 G communication systems.

Original language	English
Title of host publication	2025 IEEE 68th International Midwest Symposium on Circuits and Systems, MWSCAS 2025
Publisher	Institute of Electrical and Electronics Engineers Inc.
Pages	25-29
Number of pages	5
ISBN (Electronic)	9798331589349
DOIs	https://doi.org/10.1109/MWSCAS53549.2025.11244517
State	Published - 2025
Event	68th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2025 - Lansing/E. Lansing, United States Duration: Aug 10 2025 → Aug 13 2025

Publication series

Name	Midwest Symposium on Circuits and Systems
ISSN (Print)	1548-3746
ISSN (Electronic)	1558-3899

Conference

Conference	68th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2025
Country/Territory	United States
City	Lansing/E. Lansing
Period	08/10/25 → 08/13/25

Keywords

6G communication
spurious-free dynamic range (SFDR)
time-domain dynamic element matching (T-DEM)
time-interleaved digital-toanalog converter (TI-DAC)

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10.1109/MWSCAS53549.2025.11244517

Cite this

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title = "A T-DEM Based High-Speed Time-Interleaved Digital-to-Analog Converter",

abstract = "6G communication systems impose higher demands on the data sampling rate and linearity of digital-to-analog converters (DACs). This paper proposes a time-interleaved digital-to-analog converter (TI-DAC) design, applying tree-structured dynamic element matching (DEM) to TI-DAC, which significantly enhances the spurious-free dynamic range (SFDR). Simulation results in the Simulink environment demonstrate that the proposed TI-DAC with time-domain dynamic element matching (TDEM) improves both the data conversion speed and the SFDR of DACs, providing an effective solution for high-performance signal conversion in 6 G communication systems.",

keywords = "6G communication, spurious-free dynamic range (SFDR), time-domain dynamic element matching (T-DEM), time-interleaved digital-toanalog converter (TI-DAC)",

author = "Hao Li and Sahoo, \{Bibhu Datta\}",

note = "Publisher Copyright: {\textcopyright} 2025 IEEE.; 68th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2025 ; Conference date: 10-08-2025 Through 13-08-2025",

year = "2025",

doi = "10.1109/MWSCAS53549.2025.11244517",

language = "English",

series = "Midwest Symposium on Circuits and Systems",

publisher = "Institute of Electrical and Electronics Engineers Inc.",

pages = "25--29",

booktitle = "2025 IEEE 68th International Midwest Symposium on Circuits and Systems, MWSCAS 2025",

address = "United States",

}

Li, H & Sahoo, BD 2025, A T-DEM Based High-Speed Time-Interleaved Digital-to-Analog Converter. in 2025 IEEE 68th International Midwest Symposium on Circuits and Systems, MWSCAS 2025. Midwest Symposium on Circuits and Systems, Institute of Electrical and Electronics Engineers Inc., pp. 25-29, 68th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2025, Lansing/E. Lansing, United States, 08/10/25. https://doi.org/10.1109/MWSCAS53549.2025.11244517

A T-DEM Based High-Speed Time-Interleaved Digital-to-Analog Converter. / Li, Hao; Sahoo, Bibhu Datta.
2025 IEEE 68th International Midwest Symposium on Circuits and Systems, MWSCAS 2025. Institute of Electrical and Electronics Engineers Inc., 2025. p. 25-29 (Midwest Symposium on Circuits and Systems).

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution › peer-review

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AU - Sahoo, Bibhu Datta

PY - 2025

Y1 - 2025

N2 - 6G communication systems impose higher demands on the data sampling rate and linearity of digital-to-analog converters (DACs). This paper proposes a time-interleaved digital-to-analog converter (TI-DAC) design, applying tree-structured dynamic element matching (DEM) to TI-DAC, which significantly enhances the spurious-free dynamic range (SFDR). Simulation results in the Simulink environment demonstrate that the proposed TI-DAC with time-domain dynamic element matching (TDEM) improves both the data conversion speed and the SFDR of DACs, providing an effective solution for high-performance signal conversion in 6 G communication systems.

AB - 6G communication systems impose higher demands on the data sampling rate and linearity of digital-to-analog converters (DACs). This paper proposes a time-interleaved digital-to-analog converter (TI-DAC) design, applying tree-structured dynamic element matching (DEM) to TI-DAC, which significantly enhances the spurious-free dynamic range (SFDR). Simulation results in the Simulink environment demonstrate that the proposed TI-DAC with time-domain dynamic element matching (TDEM) improves both the data conversion speed and the SFDR of DACs, providing an effective solution for high-performance signal conversion in 6 G communication systems.

KW - 6G communication

KW - spurious-free dynamic range (SFDR)

KW - time-domain dynamic element matching (T-DEM)

KW - time-interleaved digital-toanalog converter (TI-DAC)

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DO - 10.1109/MWSCAS53549.2025.11244517

M3 - Conference contribution

AN - SCOPUS:105029739960

T3 - Midwest Symposium on Circuits and Systems

SP - 25

EP - 29

BT - 2025 IEEE 68th International Midwest Symposium on Circuits and Systems, MWSCAS 2025

PB - Institute of Electrical and Electronics Engineers Inc.

T2 - 68th IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2025

Y2 - 10 August 2025 through 13 August 2025

ER -

A T-DEM Based High-Speed Time-Interleaved Digital-to-Analog Converter

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Keywords

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