A Review of High Voltage Challenges and Developments of Power Electronics Packaging

Enormous demand for multiple operation scenarios requires structural and material innovations for high-power electronic devices. Several review papers demonstrated the process and advantages of power module packaging around 2020, summarizing the existing problems caused by high switching rate, high voltage isolation, high temperature and thermal management. With the development of the power module packaging, a large number of studies have boomed in the last two years from different research aspects. This paper thoroughly reviews the most recent researches on high voltage challenges and implications from various aspects, including the electric field simulation and experiments, insulation problems under high switching frequency and high slew rate. The promising package cooling process as well as the possible discharge detection and monitoring methods are also exhibited, providing references for wide bandgap (WBG) and ultra-wide bandgap (UWBG) devices.