Abstract
A new low-temperature biochemically compatible polymer bonding process has been successfully developed. The bonding has been characterized for bond strength and chemical resistance. This technique has successfully addressed a major challenge in the development of microfluidic systems from discrete components by enabling the bonding of the components to the microfluidic motherboards at low temperatures and ensuring reliable, leak-proof and chemically inert bonding. This bonding technique uses a spin-on Teflon-like amorphous fluorocarbon polymer. The bonding technique lowers the bonding temperature (∼160°C), shows a good bond strength of 4.3 MPa in silicon-to-silicon, and has excellent chemical resistance to various chemicals used in microelectromechanical systems processing.
| Original language | English |
|---|---|
| Pages (from-to) | 187-191 |
| Number of pages | 5 |
| Journal | Journal of Micromechanics and Microengineering |
| Volume | 12 |
| Issue number | 2 |
| DOIs | |
| State | Published - Feb 2002 |
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