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A low-power asymmetric source driver level converter based current-mode signaling scheme for global interconnects

  • SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

Global interconnects pose a significant challenge to the dense Very Deep Submicron (VDSM) System-on-Chips (SoC), due to increasing wire delay and its variations. Hence, interconnection techniques which decrease delay, delay variation and ensure signal integrity, play an important role in future technologies. In this regard, current-mode low-swing interconnection techniques provide an attractive alternative to conventional full-swing voltage-mode techniques in terms of delay, power and noise immunity. In this paper, we present a new current-mode low swing interconnection technique that reduces the delay and delay variations in global interconnects. Simulation results indicate significant savings in power, reduction in delay and increase in noise immunity compared to other techniques.

Original languageEnglish
Title of host publicationProceedings - 19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
Pages491-494
Number of pages4
DOIs
StatePublished - 2006
Event19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design - Hyderabad, India
Duration: Jan 3 2006Jan 7 2006

Publication series

NameProceedings of the IEEE International Conference on VLSI Design
Volume2006
ISSN (Print)1063-9667

Conference

Conference19th International Conference on VLSI Design held jointly with 5th International Conference on Embedded Systems Design
Country/TerritoryIndia
CityHyderabad
Period01/3/0601/7/06

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