@inproceedings{137cbb69bb4249feaf189313087d9ac1,
title = "A damage mechanics based unified thermo-viscoplasticity model for Pb/Sn solder joints",
abstract = "Sn-Pb eutectic/near-eutectic solder alloy is extensively used in microelectronics packaging interconnects. Due to the high homologous temperature eutectic Sn-Pb solder exhibits creep-plasticity interaction and significant time, temperature, stress and rate dependent material characteristics. The microstructure is often unstable, and significantly affects the flow behavior of solder joints at high homologous temperatures. Such complex behavior makes the constitutive modeling an extremely difficult task. A viscoplasticity model unified with a thermodynamics based damage model is proposed in this paper. The proposed model takes into account isotropic hardening, kinematic hardening and microstructure evolution. The model is verified against various test data, and shows strong application potential for modeling thermal viscoplastic behavior and fatigue life of solder joints in microelectronics packaging. The proposed model requires a few material parameters yet it is very powerful.",
keywords = "Damage, Sn-Pb solder joint, Unified, Viscoplasticity",
author = "Y. Zhao and C. Basaran",
year = "2001",
language = "English",
isbn = "0791835405",
series = "Advances in Electronic Packaging",
pages = "375--382",
booktitle = "Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization",
note = "Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition ; Conference date: 08-07-2001 Through 13-07-2001",
}