TY - GEN
T1 - A Damage Mechanics Based Thermomechanical Fatigue Life Prediction Model
AU - Tang, Hong
AU - Basaran, Cemal
AU - Dishongh, Terry
AU - Searls, Damion
PY - 2001
Y1 - 2001
N2 - A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical loading, is quantified within a thermodynamic framework. The damage, as an internal state variable, is coupled with unified viscoplastic constitutive model to characterize the response of eutectic solder joints. The damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in ABAQUS to simulate the cyclic softening behavior of solder joints. Several computational simulations of uniaxial monotonic tensile and cyclic shear tests are conducted to validate the model with experimental results. The behavior of Ball Grid Array (BGA) package under thermal fatigue loading is also simulated and compared with experimental results.
AB - A thermomechanical fatigue life prediction model based on the theory of damage mechanics is presented. The damage evolution, corresponding to the material degradation under cyclic thermomechanical loading, is quantified within a thermodynamic framework. The damage, as an internal state variable, is coupled with unified viscoplastic constitutive model to characterize the response of eutectic solder joints. The damage-coupled viscoplastic model with kinematic and isotropic hardening is implemented in ABAQUS to simulate the cyclic softening behavior of solder joints. Several computational simulations of uniaxial monotonic tensile and cyclic shear tests are conducted to validate the model with experimental results. The behavior of Ball Grid Array (BGA) package under thermal fatigue loading is also simulated and compared with experimental results.
UR - https://www.scopus.com/pages/publications/0348199199
M3 - Conference contribution
AN - SCOPUS:0348199199
SN - 0791835405
SN - 9780791835401
T3 - Advances in Electronic Packaging
SP - 541
EP - 551
BT - Advances in Electronic Packaging; Electrical Design, Simulation, and Test, Mems, Materials and Processing, Modeling and Characterization
T2 - Pacific Rim/International, Intersociety Electronic Packaging Technical/Business Conference and Exhibition
Y2 - 8 July 2001 through 13 July 2001
ER -