TY - GEN
T1 - A Curvature Compensated Bandgap Circuit Exploiting Temperature Dependence of β
AU - Mothukuru, Radha Krishna
AU - Kumar, Manish
AU - Sahoo, Bibhu Datta
N1 - Publisher Copyright:
© 2019 IEEE.
PY - 2019/8
Y1 - 2019/8
N2 - This paper proposes a technique for the curvature compensation in Bandgap references to obtain a better Temperature Coefficient (TC). The proposed method is based on the fact that the Bipolar junction transistors used in Bandgap references have finite Beta which is temperature dependent. As β of NPN transistors in CMOS process is very low, Darlington configuration is used to achieve larger β to achieve the desired curvature compensation. Designed and simulated in TSMC 180-nm CMOS process the proposed bandgap circuit achieves a temperature coefficient of 9.9 ppm/°C across a temperature range of -40°C to 125°C and a line regulation from 1.6 V to 4.0 V.
AB - This paper proposes a technique for the curvature compensation in Bandgap references to obtain a better Temperature Coefficient (TC). The proposed method is based on the fact that the Bipolar junction transistors used in Bandgap references have finite Beta which is temperature dependent. As β of NPN transistors in CMOS process is very low, Darlington configuration is used to achieve larger β to achieve the desired curvature compensation. Designed and simulated in TSMC 180-nm CMOS process the proposed bandgap circuit achieves a temperature coefficient of 9.9 ppm/°C across a temperature range of -40°C to 125°C and a line regulation from 1.6 V to 4.0 V.
KW - Bandgap Reference (BGR)
KW - Complementary-to-absolute-Temperature (CTAT)
KW - Darlington Pair
KW - Negative temperature Coefficient (NTC)
KW - Positive Temperature Coefficient (PTC)
KW - Proportional-to-absolute-temperature (PTAT)
KW - Temperature Coefficient (TC)
UR - https://www.scopus.com/pages/publications/85074987726
U2 - 10.1109/MWSCAS.2019.8885233
DO - 10.1109/MWSCAS.2019.8885233
M3 - Conference contribution
AN - SCOPUS:85074987726
T3 - Midwest Symposium on Circuits and Systems
SP - 509
EP - 512
BT - 2019 IEEE 62nd International Midwest Symposium on Circuits and Systems, MWSCAS 2019
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 62nd IEEE International Midwest Symposium on Circuits and Systems, MWSCAS 2019
Y2 - 4 August 2019 through 7 August 2019
ER -