TY - GEN
T1 - A Comparison of Viscoplastic and Plastic Constitutive Models for Pb/Sn Solder Alloys
AU - Basaran, Cemal
N1 - Publisher Copyright:
© 1996 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 1996
Y1 - 1996
N2 - In the literature there has been a number of constitutive models proposed for modeling thermomechanical behavior of Pb/Sn solder alloys. Some of these models are based on the plasticity (using time independent irreversible deformations), and some are based on the viscoplasticity (using time dependent irreversible deformations). In this paper it is demonstrated that Pb/Sn solder alloys are highly viscous materials, and that their behavior cannot accurately be modeled with a plasticity based model.
AB - In the literature there has been a number of constitutive models proposed for modeling thermomechanical behavior of Pb/Sn solder alloys. Some of these models are based on the plasticity (using time independent irreversible deformations), and some are based on the viscoplasticity (using time dependent irreversible deformations). In this paper it is demonstrated that Pb/Sn solder alloys are highly viscous materials, and that their behavior cannot accurately be modeled with a plasticity based model.
UR - https://www.scopus.com/pages/publications/85169425320
U2 - 10.1115/IMECE1996-0729
DO - 10.1115/IMECE1996-0729
M3 - Conference contribution
AN - SCOPUS:85169425320
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings (IMECE)
SP - 149
EP - 153
BT - Structural Analysis in Microelectronics and Fiber Optics
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1996 International Mechanical Engineering Congress and Exposition, IMECE 1996
Y2 - 17 November 1996 through 22 November 1996
ER -