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A Campus Prototype of Interactive Digital Twin in Cyber Manufacturing

  • Matthew Rubino
  • , Michelle Weng
  • , Jiasheng Chen
  • , Shardul Saptarshi
  • , Marcus Francisco
  • , Alex Francisco
  • , Chi Zhou
  • , Hongyue Sun
  • , Wenyao Xu
  • SUNY Buffalo

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

5 Scopus citations

Abstract

Smart manufacturing and Industry 4.0 are bringing disruptive changes to the manufacturing sector. Smart manufacturing increases productivity, creates safer conditions for workers, and simplifies product customization, all while decreasing business expenses [2]. To this end, we have created a flexible three-component architecture for remote machine management, using it to build a digital twin prototype of a Creality Ender-3 Pro 3D printer located on the University at Buffalo campus. This twin provides users with the ability to monitor and control the machine from anywhere in the world through a web interface. Our system improves upon existing technologies, such as Octoprint [1], through the addition of twin views. It also relies upon cheaper components, using the Arduino and ESP32 rather than the Raspberry Pi. Finally, existing technologies tend to focus on one specific type of machine. In contrast, our framework is flexible, capable of supporting many different machines.

Original languageEnglish
Title of host publicationSenSys 2022 - Proceedings of the 20th ACM Conference on Embedded Networked Sensor Systems
PublisherAssociation for Computing Machinery, Inc
Pages758-759
Number of pages2
ISBN (Electronic)9781450398862
DOIs
StatePublished - Jan 24 2023
Event20th ACM Conference on Embedded Networked Sensor Systems, SenSys 2022 - Boston, United States
Duration: Nov 6 2022Nov 9 2022

Publication series

NameSenSys 2022 - Proceedings of the 20th ACM Conference on Embedded Networked Sensor Systems

Conference

Conference20th ACM Conference on Embedded Networked Sensor Systems, SenSys 2022
Country/TerritoryUnited States
CityBoston
Period11/6/2211/9/22

Keywords

  • IoT
  • cloud computing
  • digital manufacturing
  • industry 4.0
  • virtual engineering

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