η-Cu6Sn5 precipitates in Cu PbSn solder joints

L. E. Felton; K. Rajan; P. J. Ficalora; P. Singh

doi:10.1016/0956-716X(91)90024-U

η-Cu₆Sn₅ precipitates in Cu PbSn solder joints

L. E. Felton
, K. Rajan
, P. J. Ficalora
, P. Singh

Department of Materials Design and Innovation

Rensselaer Polytechnic Institute
IBM

Research output: Contribution to journal › Article › peer-review

10 Scopus citations

Original language	English
Pages (from-to)	2329-2333
Number of pages	5
Journal	Scripta Metallurgica et Materialia
Volume	25
Issue number	10
DOIs	https://doi.org/10.1016/0956-716X(91)90024-U
State	Published - Oct 1991

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@article{781d17c4188b4706a02b3bc1979123ee,

title = "η-Cu6Sn5 precipitates in Cu PbSn solder joints",

author = "Felton, \{L. E.\} and K. Rajan and Ficalora, \{P. J.\} and P. Singh",

year = "1991",

month = oct,

doi = "10.1016/0956-716X(91)90024-U",

language = "English",

volume = "25",

pages = "2329--2333",

journal = "Scripta Metallurgica et Materialia",

issn = "0956-716X",

publisher = "Pergamon Press Ltd.",

number = "10",

}

TY - JOUR

T1 - η-Cu6Sn5 precipitates in Cu PbSn solder joints

AU - Felton, L. E.

AU - Rajan, K.

AU - Ficalora, P. J.

AU - Singh, P.

PY - 1991/10

Y1 - 1991/10

UR - https://www.scopus.com/pages/publications/0026238606

U2 - 10.1016/0956-716X(91)90024-U

DO - 10.1016/0956-716X(91)90024-U

M3 - Article

AN - SCOPUS:0026238606

SN - 0956-716X

VL - 25

SP - 2329

EP - 2333

JO - Scripta Metallurgica et Materialia

JF - Scripta Metallurgica et Materialia

IS - 10

ER -

η-Cu₆Sn₅ precipitates in Cu PbSn solder joints

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