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β-Gallium oxide power electronics

  • Andrew J. Green
  • , James Speck
  • , Grace Xing
  • , Peter Moens
  • , Fredrik Allerstam
  • , Krister Gumaelius
  • , Thomas Neyer
  • , Andrea Arias-Purdue
  • , Vivek Mehrotra
  • , Akito Kuramata
  • , Kohei Sasaki
  • , Shinya Watanabe
  • , Kimiyoshi Koshi
  • , John Blevins
  • , Oliver Bierwagen
  • , Sriram Krishnamoorthy
  • , Kevin Leedy
  • , Aaron R. Arehart
  • , Adam T. Neal
  • , Shin Mou
  • Steven A. Ringel, Avinash Kumar, Ankit Sharma, Krishnendu Ghosh, Uttam Singisetti, Wenshen Li, Kelson Chabak, Kyle Liddy, Ahmad Islam, Siddharth Rajan, Samuel Graham, Sukwon Choi, Zhe Cheng, Masataka Higashiwaki
  • Air Force Research Laboratory
  • University of California at Santa Barbara
  • Cornell University
  • ON Semiconductor Corporation
  • Teledyne Scientific
  • Novel Crystal Technology, Inc.
  • Paul Drude Institute for Solid State Electronics
  • Ohio State University
  • SUNY Buffalo
  • Georgia Institute of Technology
  • Pennsylvania State University
  • University of Illinois at Urbana-Champaign
  • Japan National Institute of Information and Communications Technology

Research output: Contribution to journalArticlepeer-review

505 Scopus citations

Abstract

Gallium Oxide has undergone rapid technological maturation over the last decade, pushing it to the forefront of ultra-wide band gap semiconductor technologies. Maximizing the potential for a new semiconductor system requires a concerted effort by the community to address technical barriers which limit performance. Due to the favorable intrinsic material properties of gallium oxide, namely, critical field strength, widely tunable conductivity, mobility, and melt-based bulk growth, the major targeted application space is power electronics where high performance is expected at low cost. This Roadmap presents the current state-of-the-art and future challenges in 15 different topics identified by a large number of people active within the gallium oxide research community. Addressing these challenges will enhance the state-of-the-art device performance and allow us to design efficient, high-power, commercially scalable microelectronic systems using the newest semiconductor platform.

Original languageEnglish
Article number029201
JournalAPL Materials
Volume10
Issue number2
DOIs
StatePublished - Feb 1 2022

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