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SUBMICRON NICKEL FILAMENTS AS A NEW ELECTRICALLY CONDUCTING FILLER FOR INTERCONNECTIONS AND ELECTROMAGNETIC INTERFERENCE
Chung, Deborah
(PI)
University At Buffalo
Project
:
Research
Overview
Project Details
Status
Finished
Effective start/end date
09/1/95
→
08/31/00
Funding
US Department of Defense Advanced Res Project Agcy:
$217,084.00
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